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公开(公告)号：US12237567B2
公开(公告)日：2025-02-25
申请号：US18067119
申请日：2022-12-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hojin Jung , Hyunsuk Kim , Kyungmoon Seol , Seongyong An , Hyoungtak Cho , Youngmin Ji , Jaebong Chun , Hochul Hwang
Abstract: According to various embodiments of the disclosure, an electronic device may include: a first housing, a second housing, a printed circuit board (PCB), and a wireless communication circuit, wherein the first housing may include a first surface and a second surface perpendicular to the first surface at a first edge, and a first conductive area, and the first conductive area may include a first portion of a first slit extending from a point on the first surface to the first edge, a third surface of the second housing may include a second conductive area, and the second conductive area may include a second slit, wherein, in a first state, at least a portion of the first portion of the first slit may overlap the second slit when viewed in a second direction perpendicular to the first surface of the first housing, and wherein the wireless communication circuit may be configured to transmit and/or receive a signal of a first frequency band based on an electrical path including the first portion.
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公开(公告)号：US12176603B2
公开(公告)日：2024-12-24
申请号：US18061665
申请日：2022-12-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sumin Yun , Kookjoo Lee , Minwoo Lee , Juseok Lee , Wonhee Choe , Hosaeng Kim , Jinwoo Jung , Jaebong Chun , Hochul Hwang
Abstract: An electronic device may include a display panel, a conductive pattern panel disposed on the display panel, an antenna pattern formed in a second region of the conductive pattern panel, a first dummy pattern including a plurality of conductive lines, a wireless communication circuit electrically connected to the antenna pattern, and at least one processor electrically connected to the display panel, the conductive pattern panel, and the wireless communication circuit, and the at least one processor may be configured to receive a radio frequency (RF) signal at least by using the antenna pattern and/or the wireless communication circuit.
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3.发明授权公开(公告)号：US11984959B2
公开(公告)日：2024-05-14
申请号：US17987253
申请日：2022-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongil Son , Chihyun Cho , Jaebong Chun
IPC: H04B7/06 , H04B7/0413
CPC classification number: H04B7/0639 , H04B7/0413
Abstract: An electronic device may comprise: a first cover; a second cover coupled to the first cover and configured to perform a sliding operation; a rollable display including a first display area visible in a rolled state and a second display area unrolled in response to the sliding operation of the second cover; a first antenna including a plurality of first antenna elements disposed in the first display area of the rollable display; a second antenna including a plurality of second antenna elements disposed in the second display area of the rollable display; and a processor. The processor may be configured to: form a plurality of directional beams using the first antenna based on a first beam table in a rolled state of the rollable display, and to form a plurality of directional beams using at least a part of the second antenna elements and the first antenna based on a second beam table based on the size of a visible area of the rollable display increasing from the rolled state.
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公开(公告)号：US11616288B2
公开(公告)日：2023-03-28
申请号：US17341900
申请日：2021-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehyung Kim , Jinkyu Bang , Hanbin Lee , Sangmin Han , Jaebong Chun
Abstract: An electronic device including an antenna module is provided. The electronic device includes a 5th generation (5G) antenna module that includes an antenna array, at least one conductive region operating as a ground with respect to the antenna array, and a first communication circuit feeding a power to the antenna array to communicate through a millimeter wave signal, and a printed circuit board (PCB) that includes a second communication circuit and a ground region. The second communication circuit feeds the power to an electrical path at least including the at least one conductive region and transmits or receives a signal in a frequency band different from a frequency band of the millimeter wave signal based on the electrical path supplied with the power and the ground region.
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公开(公告)号：US11570407B2
公开(公告)日：2023-01-31
申请号：US16697738
申请日：2019-11-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongjoo Shin , Sohyeon Kim , Inyoung Lee , Yuri Sin , Jiwoo Lee , Jaebong Chun
Abstract: Various embodiments relate to an electronic device that supports millimeter wave communication. The electronic device may include: a housing; an antenna structure including at least one antenna comprising a portion of the housing or positioned in the housing, and including an annular conductive structure comprising a conductive material, the annular conductive structure having a first surface facing an outside of the housing, a second surface facing a direction opposite the first surface, an internal space defined by the first surface and the second surface, and a plurality of slots having a repeating pattern and formed through the first surface to the internal space; a conductive member comprising a conductive material disposed in the internal space; a wireless communication circuit electrically connected with the conductive member and configured to form a directional beam using the antenna structure; and a ground electrically connected to the annular conductive structure.
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Patent Agency Ranking
公开(公告)号：US11450966B2
公开(公告)日：2022-09-20
申请号：US17269798
申请日：2019-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Myunghun Jeong , Sehyun Park , Sumin Yun , Jehun Jong , Jaehoon Jo , Jinwoo Jung , Jaebong Chun
Abstract: According to various embodiments, an electronic device may include a housing, an antenna structure disposed inside the housing and including a first face, a second face facing away from the first face, a first conductive helical pattern which extends between the first face and the second face and is constructed inside the antenna structure, and a second conductive helical pattern which extends between the first face and the second face, overlaps with at least in part with the first conductive helical pattern when viewed from above the first face, and is constructed inside the antenna structure, and at least one wireless communication circuit electrically coupled to a first point of the first conductive helical pattern and a second point of the second conductive helical pattern. The first point may be disposed to be spaced apart from the second point when viewed from above the first face. The at least one wireless communication circuit may be configured to provide the first point with a first signal having a frequency between 3 GHz and 100 GHz, and provide the second point with a second signal having a first phase difference with the first signal and having the frequency. Various other embodiments may also be possible.
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公开(公告)号：US11363711B2
公开(公告)日：2022-06-14
申请号：US16200401
申请日：2018-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehoon Jo , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaebong Chun , Eunseok Hong
Abstract: According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.
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公开(公告)号：US11196180B2
公开(公告)日：2021-12-07
申请号：US16927165
申请日：2020-07-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehoon Jo , Dongyeon Kim , Hosaeng Kim , Seongjin Park , Taeyoon Seo , Sumin Yun , Myunghun Jeong , Jinwoo Jung , Jaebong Chun
Abstract: An electronic device including an antenna is provided. The electronic device includes a housing that includes a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, the side member being coupled to the second plate or integrally formed with the second plate, a printed circuit board that is disposed in the space and includes a first conductive layer, a second conductive layer, a third conductive layer, and a ground, and an antenna structure that is disposed in the space. The antenna structure includes a first conductive pattern that is formed at the first conductive layer and is electrically connected with a first feeding line, a second conductive pattern that is formed at the second conductive layer interposed between the first conductive layer and the third conductive layer and is electrically connected with the ground, and a third conductive pattern that is formed at the third conductive layer and is electrically connected with a second feeding line. The first conductive pattern includes a first conductive line extended in a first direction parallel to the first conductive layer, and a first radiation part extended from the first conductive line in a second direction making a first angle between 0 to −90 degrees with the first direction. The third conductive pattern includes a second conductive line extended in the first direction, and a second radiation part extended from the second conductive line in a third direction making a second angle between 0 to +90 degrees with the first direction. The second conductive pattern includes a portion electrically connected with the ground, a third conductive line extended from the portion in the first direction, a third radiation part extended from the third conductive line in a fourth direction facing away from the second direction, a fourth conductive line spaced from the third conductive line and extended from the portion in the first direction, and a fourth radiation part extended from the fourth conductive line in a fifth direction facing away from the third direction.
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公开(公告)号：US11069956B2
公开(公告)日：2021-07-20
申请号：US16522019
申请日：2019-07-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehyung Kim , Jinkyu Bang , Hanbin Lee , Sangmin Han , Jaebong Chun
Abstract: An electronic device including an antenna module is provided. The electronic device includes a 5th generation (5G) antenna module that includes an antenna array, at least one conductive region operating as a ground with respect to the antenna array, and a first communication circuit feeding a power to the antenna array to communicate through a millimeter wave signal, and a printed circuit board (PCB) that includes a second communication circuit and a ground region. The second communication circuit feeds the power to an electrical path at least including the at least one conductive region and transmits or receives a signal in a frequency band different from a frequency band of the millimeter wave signal based on the electrical path supplied with the power and the ground region.
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公开(公告)号：US12148981B2
公开(公告)日：2024-11-19
申请号：US17493326
申请日：2021-10-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sukchan Hong , Minhong Do , Seongjin Park , Kyungrok Lee , Seokwoo Lee , Jaebong Chun , Hyunsuk Choi
Abstract: Disclosed is an electronic device including a plurality of radio frequency integrated circuits (RFICs) that delivers a digital signal, which is to be transmitted by a modem through an antenna configured to transmit and/or receive a radio frequency (RF) signal, in a form of the RF signal and to deliver the RF signal received from the antenna, in a direction of the modem, wherein the plurality of RFICs are at least partially connected to one another, an inter frequency integrated circuit (IFIC) connected to at least some RFICs among the plurality of RFICs and configured to receive the digital signal from the modem, to convert the digital signal to an inter frequency (IF) signal, to deliver the IF signal to the RFIC, to convert the RF signal delivered from the RFIC to the IF signal, and to deliver the IF signal to the modem, and a plurality of compensation units respectively connected to the plurality of RFICs or respectively positioned inside of the plurality of RFICs, the compensation units comprising circuitry configured to compensate for a loss of the IF signal occurring between the IFIC and the at least some RFICs or to compensate for a loss of the IF signal occurring between the plurality of RFICs.
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