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    Semiconductor package
    1.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10910346B2

    公开(公告)日：2021-02-02

    申请号：US16445861

    申请日：2019-06-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-seok Hong ,  Ji-hoon Kim

    IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00

    Abstract: A semiconductor package includes: a lower semiconductor chip including a first semiconductor substrate, which includes a first semiconductor device on an active surface thereof and a protrusion defined by a recess region on an inactive surface thereof opposite to the active surface, a plurality of external connecting pads on a bottom surface of the first semiconductor substrate, and a plurality of through-electrodes electrically connected to the plurality of external connecting pads; and at least one upper semiconductor chip stacked on the protrusion of the lower semiconductor chip and electrically connected to the plurality of through-electrodes, the at least one upper semiconductor chip including a second semiconductor substrate which includes a second semiconductor device on an active surface thereof.

    Semiconductor devices including a support structure to connect to and support electrodes
    2.
    发明授权
    Semiconductor devices including a support structure to connect to and support electrodes 有权

    公开(公告)号：US10685877B2

    公开(公告)日：2020-06-16

    申请号：US15664321

    申请日：2017-07-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-hoon Kim

    IPC: H01L21/768 ,  H01L27/108 ,  H01L49/02

    Abstract: A semiconductor device includes: a plurality of lower electrodes arranged on a substrate in a first direction, which is parallel to a main surface of the substrate, and a second direction parallel to the main surface of the substrate and perpendicular to the first direction; and a support structure pattern configured to connect the plurality of lower electrodes to each other to support the plurality of lower electrodes, on the substrate and including a plurality of open portions. The plurality of open portions have shapes extending longer in the second direction than in the first direction, and when viewed from inner sides of the plurality of open portions, the plurality of open portions are convex in the first direction and are concave in the second direction.

    User terminal apparatus and control method thereof
    3.
    发明授权
    User terminal apparatus and control method thereof 有权

    公开(公告)号：US11245694B2

    公开(公告)日：2022-02-08

    申请号：US16467184

    申请日：2017-12-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyung-soo Kwag ,  Ji-hoon Kim

    IPC: H04L29/06

    Abstract: A user terminal apparatus may include a communication unit for communicating with a server; a memory in which applications are stored; and a processor for executing an application including a first logic which requires security processing, performing mutual verification with the server, controlling the communication unit such that a request for executing the first logic on the server is sent to the server, and when the execution result of the first logic is received from the server, proceeding with the execution of the application by using the received execution result.

    Semiconductor devices
    4.
    发明授权
    Semiconductor devices 有权

    公开(公告)号：US11069569B2

    公开(公告)日：2021-07-20

    申请号：US15930905

    申请日：2020-05-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-hoon Kim

    IPC: H01L21/768 ,  H01L27/108 ,  H01L49/02

    Abstract: A semiconductor device includes: a plurality of lower electrodes arranged on a substrate in a first direction, which is parallel to a main surface of the substrate, and a second direction parallel to the main surface of the substrate and perpendicular to the first direction; and a support structure pattern configured to connect the plurality of lower electrodes to each other to support the plurality of lower electrodes, on the substrate and including a plurality of open portions. The plurality of open portions have shapes extending longer in the second direction than in the first direction, and when viewed from inner sides of the plurality of open portions, the plurality of open portions are convex in the first direction and are concave in the second direction.

    Semiconductor memory device
    9.
    发明授权
    Semiconductor memory device 有权

    公开(公告)号：US10079237B2

    公开(公告)日：2018-09-18

    申请号：US15645261

    申请日：2017-07-10

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-hoon Kim ,  Won-chul Lee

    IPC: H01L49/02 ,  H01L27/108 ,  H01L23/00

    CPC classification number: H01L27/10808 ,  H01L23/562 ,  H01L27/10852 ,  H01L28/86 ,  H01L28/90

    Abstract: A semiconductor memory device may include: a substrate having a cell area defined thereon, the cell area including a cell block area and an edge area; a plurality of bottom electrodes, on the substrate, which are in parallel with a top surface of the substrate and a first direction in parallel with a top surface of the substrate, and are arranged along a second direction intersecting the first direction; and a support structure pattern, in a flat plate shape, which connects the bottom electrodes to each other, supports the bottom electrodes onto the substrate, and includes a plurality of open areas, wherein a first profile, which is a horizontal cross-sectional profile in the edge area of the support structure pattern, has a wave shape.

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