公开(公告)号：US20130323864A1

公开(公告)日：2013-12-05

申请号：US13761157

申请日：2013-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Bum Mo ,  Byoung-Joo Kim ,  Jin-Su Kim

IPC: H01L21/66 ,  G01R31/26

CPC classification number: H01L22/14 ,  G01R31/2601 ,  G01R31/2891 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device including a substrate is disclosed. The method includes: providing the substrate on a wafer chuck; positioning a probe card having probe needles above the substrate; positioning a tester head above the probe card; using a sensor included in the tester head, measuring a deformation of the probe card; using a variable load device included in the tester head, adjusting the deformation of the probe card based on the measured deformation; and testing the substrate using the adjusted probe card.

Abstract translation: 公开了一种制造包括衬底的半导体器件的方法。 该方法包括：将基板设置在晶片卡盘上; 将具有探针的探针卡定位在基底上方; 将测试头放在探针卡上方; 使用包含在测试头中的传感器，测量探针卡的变形; 使用包含在测试头中的可变负载装置，根据测量的变形调整探针卡的变形; 并使用调整后的探针卡测试基板。

公开(公告)号：US10128676B2

公开(公告)日：2018-11-13

申请号：US14475055

申请日：2014-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki-Wook Han ,  Jin-Su Kim

IPC: H02J7/00

Abstract: An electronic device is provided that includes: a terminal unit including a first terminal and a second terminal; a driver configured to provide one of a first signal and a second signal to the first terminal, the first signal having a first current level and the second signal having a second current level; and a driving controller configured to cause the driver to detect, at the second terminal, a third signal having the same current level as the first signal, and cause the driver to provide the second signal to the first terminal in response to detecting the third signal.

公开(公告)号：US09341941B2

公开(公告)日：2016-05-17

申请号：US14336643

申请日：2014-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Shin Lee ,  Jae-Hyuck Choi ,  Soo-Wan Koh ,  Jin-Su Kim ,  Hyung-Ho Ko

IPC: B32B3/00 ,  G03F1/52 ,  G03F1/24

CPC classification number: G03F1/52 ,  G03F1/24 ,  Y10T428/24802

Abstract: A reflective photomask blank, a reflective photomask and an integrated circuit device manufactured by using a reflective photomask, include a multi-layered reflection layer; a capping layer on the multi-layered reflection layer and including a first transition metal; a passivation film contacting at least a portion of the capping layer on a side opposite to the multi-layered reflection layer and including a second transition metal and a nitrogen (N) atom; and a light absorption pattern covering a portion of the capping layer.

Abstract translation: 反射光掩模坯料，反射光掩模和通过使用反射光掩模制造的集成电路器件包括多层反射层; 所述多层反射层上的覆盖层包括第一过渡金属; 钝化膜，与所述多层反射层相反的一侧与所述覆盖层的至少一部分接触，并且包括第二过渡金属和氮（N）原子; 以及覆盖覆盖层的一部分的光吸收图案。