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1.发明授权公开(公告)号：US11837573B2
公开(公告)日：2023-12-05
申请号：US17166805
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhyung Kim , Joongha Lee , Sangha Park , Sunghyup Kim , Kyeongbin Lim
IPC: H01L23/00
CPC classification number: H01L24/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75502 , H01L2924/3511
Abstract: A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.
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公开(公告)号：US11341973B2
公开(公告)日：2022-05-24
申请号：US16474465
申请日：2017-12-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung Kim , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee
Abstract: Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.
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3.发明申请公开(公告)号：US20210398935A1
公开(公告)日：2021-12-23
申请号：US17166805
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhyung Kim , Joongha Lee , Sangha Park , Sunghyup Kim , Kyeongbin Lim
IPC: H01L23/00
Abstract: A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.
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公开(公告)号：US10541670B2
公开(公告)日：2020-01-21
申请号：US15870546
申请日：2018-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongseop Yoon , Sungchan Kang , Cheheung Kim , Sangha Park , Choongho Rhee , Hyeokki Hong
Abstract: Provided are micromechanical resonators and resonator systems including the micromechanical resonators. The micromechanical resonators may each include a supporting beam including a fixed end fixed on a supporting member and a loose end configured to vibrate, and a lumped mass arranged on the loose end, wherein the loose end has a width greater than a width of the fixed end, and a width of the lumped mass is greater than that the width of the fixed end.
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公开(公告)号：US20220270615A1
公开(公告)日：2022-08-25
申请号：US17741087
申请日：2022-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung KIM , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee
Abstract: Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.
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Patent Agency Ranking
公开(公告)号：US20210329395A1
公开(公告)日：2021-10-21
申请号：US17320988
申请日：2021-05-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung KIM , Sungchan Kang , Yongseop Yoon , Choongho Rhee , Sangha Park , Hyeokki Hong
Abstract: Provided are a directional acoustic sensor that detects a direction of sound, a method of detecting a direction of sound, and an electronic device including the directional acoustic sensor. The directional acoustic sensor includes a sound inlet through which a sound is received, a sound outlet through which the sound received through the sound inlet is output, and a plurality of vibration bodies arranged between the sound inlet and the sound outlet, in which one or more of the plurality of vibration bodies selectively react to the sound received by the sound inlet according to a direction of the received sound.
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公开(公告)号：US10823814B2
公开(公告)日：2020-11-03
申请号：US15908116
申请日：2018-02-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchan Kang , Cheheung Kim , Sangha Park , Yongseop Yoon , Choongho Rhee , Hyeokki Hong
IPC: G01S3/808 , G10K11/178 , G10K11/36 , G01S3/805
Abstract: Provided is a sound direction detection sensor capable of detecting a direction from which sound is coming by using a multi-resonator array. The disclosed sound direction detection sensor includes two resonator arrays, each including a plurality of resonators having different resonance frequencies. The two resonator arrays have different directivities. Each resonator array serves as an audio sensor, and the sound direction detection sensor detects a direction from which sound is incident, regardless of a distance between audio sensors.
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公开(公告)号：US09955948B2
公开(公告)日：2018-05-01
申请号：US14728341
申请日：2015-06-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchan Kang , Byunggil Jeong , Sangha Park , Hyungjae Shin
CPC classification number: A61B8/4444 , A61B2562/166 , B06B1/0292 , H01L2224/48091 , H01L2224/4824 , H01L2224/49433 , H01L2924/00014 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) probes that use wire bonding. A CMUT probe includes a CMUT chip which includes a plurality of first electrode pads which are disposed on a first surface thereof, a printed circuit board (PCB) which is disposed on the first surface of the CMUT chip and which is configured to expose the plurality of first electrode pads, a plurality of second electrode pads which are disposed on the PCB and which correspond to respective ones of the plurality of first electrode pads, and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.
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公开(公告)号：US11887606B2
公开(公告)日：2024-01-30
申请号：US17741087
申请日：2022-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Cheheung Kim , Sungchan Kang , Sangha Park , Yongseop Yoon , Choongho Rhee
Abstract: Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.
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公开(公告)号：US10602261B2
公开(公告)日：2020-03-24
申请号：US16127565
申请日：2018-09-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchan Kang , Cheheung Kim , Sangha Park , Yongseop Yoon , Choongho Rhee , Hyeokki Hong
Abstract: A directional microphone is provided which includes a substrate having a cavity that penetrates therethrough, a resonator array of at least one resonator, and a cover member. Each of the resonator array and the cover member covers covering at least a part of the cavity.
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