公开(公告)号：US20240213430A1

公开(公告)日：2024-06-27

申请号：US18393226

申请日：2023-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongwoo KIM ,  Joongil LEE ,  Jiheon OH ,  Kwonjoong KIM

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0753 ,  H01L2224/05571 ,  H01L2224/06152 ,  H01L2224/06155 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48095 ,  H01L2224/48157 ,  H01L2924/0132

Abstract: A semiconductor light emitting device includes: a substrate; a light emitting device provided on an upper surface of the substrate; a first pad provided on the upper surface of the substrate; a second pad provided on the upper surface of the light emitting device; a bonding wire connecting the light emitting device to the substrate, the bonding wire including: a first portion connected to and extending in a vertical direction from the first pad; a second portion extending from the first portion and inclined at a first angle relative to the first portion; a third portion extending from the second portion and inclined at a second angle is in a range of from about 125 degrees to about 150 degrees relative to the second portion; and a fourth portion extending from the third portion, inclined at a third angle relative to the third portion, and connected to the second pad; and a seal covering at least one side surface of the light emitting device and sealing the bonding wire on the substrate.