公开(公告)号：US20250118689A1

公开(公告)日：2025-04-10

申请号：US18782386

申请日：2024-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongkwan Lee ,  Hyunki Kim ,  Youngmin Lee ,  Hyeon Hwang

IPC: H01L23/00 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor package includes a substrate having first and second sides, pads disposed on the substrate and including first and second bonding pads adjacent to the first and second sides, respectively, and upper pads between the first and second bonding pads, a passivation layer disposed on the substrate and exposing the first and second bonding pads, a solder resist layer disposed on the passivation layer, a first chip structure on the solder resist layer, adjacent to the first side and electrically connected to the first bonding pads, a second chip structure on the solder resist layer, adjacent to the second side and electrically connected to the second bonding pads, a controller on the solder resist layer between the first and the second chip structure, and a connection structure penetrating the passivation layer and the solder resist layer and electrically connecting the controller and the upper pads.

公开(公告)号：US11615829B1

公开(公告)日：2023-03-28

申请号：US17244261

申请日：2021-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongha Kim ,  Hyunki Kim ,  Hoyoung Song

IPC: G11C11/406 ,  G11C11/408

Abstract: A memory device includes a memory cell array, a random bit generator, a comparator and a refresh controller. The memory cell array includes a plurality of memory cells coupled to a plurality of word-lines. The random bit generator generates a random binary code having a predetermined number of bits. The comparator compares the random binary code and a reference binary code to output a matching signal based on a result of the comparison. The refresh controller refreshes target memory cells from among the plurality of memory cells based on addresses accessed by a memory controller during a sampling period randomly determined based on the matching signal and a refresh command from the memory controller.

公开(公告)号：US20200350288A1

公开(公告)日：2020-11-05

申请号：US16680657

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho PARK ,  Kyungsuk Oh ,  Hyunki Kim ,  Yongkwan Lee ,  Sangsoo Kim ,  Seungkon Mok ,  Junyoung Oh ,  Changyoung Yoo

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

公开(公告)号：US12205925B2

公开(公告)日：2025-01-21

申请号：US17671065

申请日：2022-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan Lee ,  Seunghwan Kim ,  Jungjoo Kim ,  Jongwan Kim ,  Hyunki Kim ,  Junwoo Park ,  Hyunggil Baek ,  Junga Lee ,  Taejun Jeon

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: A semiconductor package includes a package substrate having a communication hole extending from an upper surface of the package substrate to a lower surface of the package substrate, a semiconductor chip attached to the upper surface of the package substrate, an auxiliary chip attached to the lower surface of the package substrate, external connection terminals attached to the lower surface of the package substrate and spaced apart from the auxiliary chip, and an encapsulant encapsulating the semiconductor chip and the auxiliary chip and filling the communication hole.

公开(公告)号：US20240038288A1

公开(公告)日：2024-02-01

申请号：US18171121

申请日：2023-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongha Kim ,  Hyunki Kim ,  Sungchul Park ,  Ju-Seop Park ,  Dongsu Lee

IPC: G11C11/406

CPC classification number: G11C11/40622 ,  G11C11/40611 ,  G11C11/40603

Abstract: In a memory device, a control circuit detects determines an aggressor row address, indicating an aggressor row of a memory cell array, at a random time. The aggressor row address or a value derived from the aggressor row address is stored in a queue. The control circuit controls a refresh operation of one or more victim rows based on the aggressor row address in response to a targeted refresh command.

公开(公告)号：US11710673B2

公开(公告)日：2023-07-25

申请号：US17376883

申请日：2021-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin Yim ,  Dongwook Kim ,  Hyunki Kim ,  Jongbo Shim ,  Jihwang Kim ,  Sungkyu Park ,  Yongkwan Lee ,  Byoungwook Jang

IPC: H01L23/12 ,  H01L23/538

CPC classification number: H01L23/12 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386

Abstract: A semiconductor package including a first package substrate, a first semiconductor chip on the first package substrate, a first conductive connector on the first package substrate and laterally spaced apart from the first semiconductor chip, an interposer substrate on the first semiconductor chip and electrically connected to the first package substrate through the first conductive connector, the interposer substrate including a first portion overlapping the first semiconductor chip and a plurality of upper conductive pads in the first portion, a plurality of spacers on a lower surface of the first portion of the interposer substrate and positioned so as not to overlap the plurality of upper conductive pads in a plan view, and an insulating filler between the interposer substrate and the first package substrate may be provided.

公开(公告)号：US20220392846A1

公开(公告)日：2022-12-08

申请号：US17887557

申请日：2022-08-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juhyeon OH ,  Sunchul Kim ,  Hyunki Kim

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

Abstract: A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip and the second substrate. The solder structures electrically connect the first substrate and the second substrate.

公开(公告)号：US11469156B2

公开(公告)日：2022-10-11

申请号：US17203084

申请日：2021-03-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunki Kim ,  Sangsoo Kim ,  Seung Hwan Kim ,  Kyung Suk Oh ,  Yongkwan Lee ,  Jongho Lee

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/00 ,  H01L23/367 ,  H01L25/07

Abstract: Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.

公开(公告)号：US20210124659A1

公开(公告)日：2021-04-29

申请号：US16890559

申请日：2020-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yesin Ryu ,  Yoonna Oh ,  Hyunki Kim

IPC: G06F11/20 ,  G06F12/10 ,  G11C29/00 ,  G11C17/16 ,  G11C17/18

Abstract: A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

公开(公告)号：US10978374B2

公开(公告)日：2021-04-13

申请号：US16285480

申请日：2019-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunki Kim ,  Sangsoo Kim ,  Seung Hwan Kim ,  Kyung Suk Oh ,  Yongkwan Lee ,  Jongho Lee

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/367 ,  H01L25/07 ,  H01L23/00

Abstract: Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.