公开(公告)号：US20190064219A1

公开(公告)日：2019-02-28

申请号：US15871561

申请日：2018-01-15

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute Of Science And Technology

Inventor： Min-woo Rhee ,  Duke Kimm ,  Jae-hong Kim ,  Ji-nyeong Yun ,  In-kyu Park ,  Jun-bo Yoon ,  Dong-uk Kwon ,  Seung-hwan Kim ,  Chang-keun Kim ,  Yong-hoon Yoon

IPC: G01R1/073 ,  H01R13/24 ,  G01R31/28 ,  G01R1/067

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

公开(公告)号：US10514392B2

公开(公告)日：2019-12-24

申请号：US15871561

申请日：2018-01-15

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute Of Science And Technology

Inventor： Min-woo Rhee ,  Duke Kimm ,  Jae-hong Kim ,  Ji-nyeong Yun ,  In-kyu Park ,  Jun-bo Yoon ,  Dong-uk Kwon ,  Seung-hwan Kim ,  Chang-keun Kim ,  Yong-hoon Yoon

IPC: G01R31/10 ,  G01R1/073 ,  G01R1/067 ,  H01R13/24 ,  G01R31/28 ,  H01R11/18 ,  H01R12/57 ,  H01R12/52 ,  H01R12/70 ,  H01R12/71

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

公开(公告)号：US10048431B2

公开(公告)日：2018-08-14

申请号：US15174807

申请日：2016-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hong-seok Lee ,  Hoon Song ,  Jun-bo Yoon ,  Joo-hyung Lee

IPC: F21V8/00 ,  B29C33/38 ,  B29C33/42 ,  B29C35/08 ,  B29C37/00 ,  B29D11/00 ,  B29K83/00

Abstract: Provided are a light guide member, a lighting apparatus including the light guide member, and a method of fabricating the light guide member. The light guide member comprises: a body, which is formed as a transparent plate, including a first surface and a second surface facing the first surface; and a plurality of dimple type optical controllers formed beneath at least one of the first surface and the second surface and having reflective surfaces that reflect light proceeding between the first and second surfaces of the body toward at least one of the first and second surfaces.