METHOD FOR VISUALIZING CUTTING PATH IN SIMULATION APPARATUS AND SIMULATION DEVICE FOR PERFORMING THE SAME

    公开(公告)号:US20250131616A1

    公开(公告)日:2025-04-24

    申请号:US18922567

    申请日:2024-10-22

    Abstract: A method for visualizing a cutting path in a simulation apparatus includes setting a first point representing a start of the cutting tool and a second point representing an end of the cutting tool, obtaining a third point representing an intersection of the target object and the cutting tool based on the first point and the second point, calculating an incident depth and an incident angle of the cutting tool based on a normal vector that is orthogonal to a first plane of the target object including the third point, the first point, the second point, and the third point, generating a normal map based on the incident angle, the incident depth, a first depth representing a maximum depth at which the target object is able to be cut by the cutting tool, and the third point, and visualizing the cutting path representing lines obtained by connecting the third points.

    MICROBOLOMETER AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20250130110A1

    公开(公告)日:2025-04-24

    申请号:US18745212

    申请日:2024-06-17

    Abstract: A microbolometer and a method of manufacturing the same are provided. The microbolometer may include a substrate, an absorption layer configured to absorb incoming light in a specific wavelength range and including an absorption body configured to float from the substrate and electrically isolated by a channel; a resistance layer provided between the substrate and the absorption body of the absorption layer and having a resistance value that changes based on temperature variations caused by thermal energy absorbed through the absorption layer; and a resistance reduction layer provided between the absorption layer and the resistance layer to reduce interface resistance and divided by a channel correspond to the channel of the absorption layer.

Patent Agency Ranking