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1.发明申请公开(公告)号：US20200024482A1
公开(公告)日：2020-01-23
申请号：US16421568
申请日：2019-05-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kenji TAKAI , Sang Eui LEE , Ken KOKUBO , Eigo MIYAZAKI , Do Yoon KIM
IPC: C09G1/02 , H01L21/321
Abstract: A polishing slurry including a composite including a hydrophilic fullerene and an ionic compound, a method of manufacturing the same, and a method of manufacturing a semiconductor device.
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