公开(公告)号：US20180053750A1

公开(公告)日：2018-02-22

申请号：US15478541

申请日：2017-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun KIM ,  Jae Jun BANG ,  Chang Ho SHIN ,  Dong Soo LEE ,  Seog Ho LIM ,  Myoung Sun HA

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/46 ,  H01L33/62 ,  H01L25/00 ,  F21V19/00

CPC classification number: H01L25/0753 ,  H01L25/50 ,  H01L33/62 ,  H01L2224/16225

Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.