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公开(公告)号：US11017202B2
公开(公告)日：2021-05-25
申请号：US16204809
申请日：2018-11-29
发明人： Sun A Kim , Jeong Hoo Kim , Seung Geol Baek , Kyung Hoon Song , Kwang Sub Lee , Gyu Sang Cho , Yun Jang Jin , Yong Seok Kim , Valeriy Prushinskiy , Se Young Jang , Chang Ryong Heo , Suk Hyun , Young Il Shin , Hyeong Wook Yang , Tushar Balasaheb Sandhan
摘要： An electronic device is provided. The electronic device includes a transparent member, a display positioned under a transparent member that includes a plurality of pixels, an image sensor positioned under some areas of the display, a memory, and a processor. The processor obtains a first image at least based on light output through at least some of the plurality of pixels and reflected by an external object coming into contact with the transparent member using the image sensor, performs authentication on the external object at least based on the at least one template using the first image, generates a second image of the external object at least based on the first image when quality of the first image corresponds to a given condition based on a result of the authentication, and performs authentication on the external object at least based on the at least one template using the second image.
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2.发明授权公开(公告)号：US10529676B2
公开(公告)日：2020-01-07
申请号：US15617973
申请日：2017-06-08
发明人： Ki Cheol Bae , Chul Woo Park , Kwang Sub Lee , Sang Gyun Lee , Se Young Jang , Chi Hyun Cho
摘要： A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.
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公开(公告)号：US10470134B2
公开(公告)日：2019-11-05
申请号：US14825623
申请日：2015-08-13
发明人： Hee Tae Kim , Se Young Jang , Bong Su Chun
IPC分类号： G08C17/00 , H04W52/02 , G06F1/324 , G06F1/3234 , G06F1/3287 , G06F1/3296 , H04W76/28
摘要： An electronic device and a method of controlling the electronic device are provided. A memory and a processor are electrically connected with the memory. The processor controls at least one of a change in a specified operation power, a change in a specified operation clock rate, and an operation state of a diversity module of the electronic device when the electronic device enters an inactive period after an active period associated with transmitting data has ended.
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公开(公告)号：US09769967B2
公开(公告)日：2017-09-19
申请号：US14843766
申请日：2015-09-02
发明人： Yun Oh Chi , Kyung Hoon Song , Kwang Sub Lee , Sae Bom Lee , Se Young Jang
IPC分类号： H05K9/00
CPC分类号： H05K9/0032 , H05K2201/0715
摘要： A shield is provided. The shield includes a shield frame surrounding an electronic component mounted on a printed circuit board and a shield cover partially coupled to the shield frame. The shield frame includes a column part mounted on the printed circuit board and a bending part bent from an upper end portion of the column part. An angle between both end portions of the bending part is smaller than about 90 degrees.
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公开(公告)号：US11216636B2
公开(公告)日：2022-01-04
申请号：US16762890
申请日：2018-10-22
发明人： Kyung Hoon Song , Jeong Hoo Kim , Sun A Kim , Kwang Sub Lee , Se Young Jang , Chi Hyun Cho
IPC分类号： G06K9/00
摘要： An electronic device is disclosed. According to an embodiment, an electronic device may comprise: a transparent member; a display panel that is disposed beneath the transparent member and comprises multiple pixels and at least one transmission area which is formed between the multiple pixels and through which light can pass; a biometric sensor which is disposed beneath the display panel and can acquire light that has been output through at least some of the multiple pixels, has been reflected by an external object near or in contact with the transparent member, and then has passed through the at least one transmission area; and a light path changing member disposed between the biometric sensor and the display panel and spaced a predetermined distance apart from the biometric sensor, the light path changing member being able to change an optical path with respect to at least a part of the light having passed through the at least one transmission area. Various other embodiments found in the specification are also possible.
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公开(公告)号：US10983558B2
公开(公告)日：2021-04-20
申请号：US16945971
申请日：2020-08-03
发明人： Hyun Woo Kim , Ji Hoon Park , Ji Hun Heo , Joo Han Kim , Jin Man Kim , Bong Jae Rhee , Se Young Jang
IPC分类号： G06K9/00 , G06F3/042 , G06F1/16 , H05K1/18 , H05K5/00 , G06F3/041 , H04M1/02 , H05K1/02 , H05K5/03 , H05K1/14 , H01L27/146 , H01L23/00 , H01L27/32
摘要： A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.
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公开(公告)号：US10957620B2
公开(公告)日：2021-03-23
申请号：US16811944
申请日：2020-03-06
发明人： Jae Ho Chung , Soo Ho Noh , Jin Seok Yoon Park , Se Young Jang
IPC分类号： H01L23/427 , H01L23/367 , C09K5/14 , G06F1/20 , H05K9/00 , H05K7/20 , H05K1/02 , H01L23/373
摘要： An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
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公开(公告)号：US10579847B2
公开(公告)日：2020-03-03
申请号：US15631472
申请日：2017-06-23
发明人： Gyu Sang Cho , Hee Cheul Moon , Hyung Dal Kim , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Myung Su Kang , Heung Sik Shin
摘要： An electronic device is provided which includes a light emitting module that radiates infrared light, a window disposed on the light emitting module and having a specific refractive index with respect to the infrared light, wherein the window includes a refraction part that totally reflects the infrared light inside the window in correspondence with the specific refractive index, and a fingerprint sensor disposed under the window and obtaining a fingerprint of a user based on a user input on the window by using scattered light of the infrared light.
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公开(公告)号：US20170372114A1
公开(公告)日：2017-12-28
申请号：US15631472
申请日：2017-06-23
发明人： Gyu Sang Cho , Hee Cheul Moon , Hyung Dal Kim , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Myung Su Kang , Heung Sik Shin
CPC分类号： G06K9/00006 , G01J1/0219 , G01J1/0233 , G01J1/0266 , G01J1/08 , G01J1/58 , G01J5/10 , G01J2001/0257 , G01N2201/061 , G01N2201/0638 , G06F3/0412 , G06F3/0421 , G06F2203/04109 , G06K9/00033 , G06K9/00114 , G06K9/00161 , G06T11/003 , G06T2207/10 , G06T2207/10008 , G06T2207/10048
摘要： An electronic device is provided which includes a light emitting module that radiates infrared light, a window disposed on the light emitting module and having a specific refractive index with respect to the infrared light, wherein the window includes a refraction part that totally reflects the infrared light inside the window in correspondence with the specific refractive index, and a fingerprint sensor disposed under the window and obtaining a fingerprint of a user based on a user input on the window by using scattered light of the infrared light.
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10.发明申请公开(公告)号：US20170358544A1
公开(公告)日：2017-12-14
申请号：US15617973
申请日：2017-06-08
发明人： Ki Cheol BAE , Chul Woo Park , Kwang Sub Lee , Sang Gyun Lee , Se Young Jang , Chi Hyun Cho
CPC分类号： H01L23/645 , H01L23/3128 , H01L23/642 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/04042 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48195 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83851 , H01L2224/92247 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1076 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19105 , H01L2924/30101 , H01L2924/30107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.
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