公开(公告)号：US20140070740A1

公开(公告)日：2014-03-13

申请号：US14081524

申请日：2013-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyoung-il KIM ,  Yong-ho YOU ,  Seong-ho SHIN ,  Young Jung YUN ,  Yae-young KIM ,  Gwon-hoon KIM ,  Ho-bin HWANG ,  Ji-young BYUN

IPC: H02P6/08

CPC classification number: H02P6/08 ,  H02P6/06 ,  H02P6/34 ,  H02P23/0004 ,  H02P23/22

Abstract: An image forming apparatus includes an engine unit to perform an image forming job; an engine control unit to control the operation of the engine unit; a brushless direct current (BLDC) motor to drive the engine unit; a sensor unit to sense electric angle information and driving velocity information of the BLDC motor; a communication interface to receive a digital control command with respect to the BLDC motor from the engine control unit; a driving signal unit to generate a driving signal to control the BLDC motor; and a digital control unit to control the operation of the driving signal unit in a digital phase locked loop (PLL) manner for feedback controls the BLDC motor, based on the received digital control command, the detected electric angle information and the driving velocity information and a digital gain value as a control factor with respect to the BLDC motor.

Abstract translation: 图像形成装置包括执行图像形成作业的发动机单元; 发动机控制单元，用于控制发动机单元的操作; 用于驱动发动机单元的无刷直流电动机（BLDC）; 用于检测所述BLDC电动机的电角信息和驱动速度信息的传感器单元; 通信接口，用于从发动机控制单元接收关于BLDC电动机的数字控制命令; 驱动信号单元，用于产生用于控制所述BLDC电动机的驱动信号; 数字控制单元，用于以数字锁相环（PLL）方式控制驱动信号单元的操作，用于基于所接收的数字控制命令，检测到的电角度信息和驱动速度信息来反馈控制BLDC电机;以及 相对于BLDC电动机的数字增益值作为控制因素。

公开(公告)号：US20130256917A1

公开(公告)日：2013-10-03

申请号：US13792942

申请日：2013-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-lyong KIM ,  Seong-ho SHIN ,  Jae-gwon JANG ,  Jong-ho LEE

IPC: H01L23/00

CPC classification number: H01L24/46 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45664 ,  H01L2924/00012

Abstract: A semiconductor package includes a master chip and a slave chip stacked on a substrate. The master chip and the slave chip are connected to one another by a bonding wire. The master chip and the slave chip are connected in series with an external circuit. The semiconductor package may have a low loading factor and excellent performance, and may be mass produced at low costs.

Abstract translation: 半导体封装包括堆叠在基板上的主芯片和从芯片。 主芯片和从芯片通过接合线彼此连接。 主芯片和从芯片与外部电路串联连接。 半导体封装可以具有低负载率和优异的性能，并且可以以低成本批量生产。