公开(公告)号：US20240061345A1

公开(公告)日：2024-02-22

申请号：US18207510

申请日：2023-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kibum LEE ,  Taesoo SHIN ,  Seulgi OK ,  Sungwook HWANG

IPC: G03F7/20

CPC classification number: G03F7/7065

Abstract: A method of detecting defects of a wafer including generating a composite wafer map comprising defect points by combining a plurality of wafer level maps generated by measuring the wafer according to the respective process operations; sorting the defect points according to defect clusters using positions of the defect points included in the composite wafer map; and detecting an initial process operation, from among the respective process operations, in which a defect occurred, using operation information, for each of the defect clusters.

公开(公告)号：US20240127425A1

公开(公告)日：2024-04-18

申请号：US18195190

申请日：2023-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungwook HWANG ,  Tae Soo SHIN ,  Seulgi OK ,  Kibum LEE

IPC: G06T7/00 ,  G01N23/2251 ,  G06T7/70

CPC classification number: G06T7/001 ,  G01N23/2251 ,  G06T7/70 ,  G01N2223/418 ,  G01N2223/6116 ,  G06T2207/10061 ,  G06T2207/20084 ,  G06T2207/20132 ,  G06T2207/30148

Abstract: A defect detection device includes: a memory configured to store a layout image indicating a circuit pattern and indicating a dummy pattern; and a controller comprising an artificial neural network configured to learn the layout image, the controller being configured to: determine, based on an inspection image obtained by photographing an area including a defect on a wafer, whether the defect is in a first area in which the circuit pattern is positioned or in a second area in which the dummy pattern is positioned, by using the artificial neural network, and determine a type of the defect based on whether the defect is positioned is in the first area or in the second area.