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公开(公告)号：US09702757B2
公开(公告)日：2017-07-11
申请号：US14804613
申请日：2015-07-21
发明人： Joon Sub Lee , Seung Won Park
CPC分类号： G01J1/42 , G01J1/58 , G01J3/0254 , G01J2001/0481 , G01J2001/4252
摘要： A light measuring system including an integrating sphere having an aperture configured by opposing reflectors selectively aligned with complementary reflectors of at least one light source mounting block having a light source mounting region for mounting a light source thereon.
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公开(公告)号：US10403603B2
公开(公告)日：2019-09-03
申请号：US15657759
申请日：2017-07-24
发明人： Seung Won Park , Yeong Kwon Ko
IPC分类号： H01L23/00 , H01L23/31 , H01L23/46 , H01L29/06 , H01L23/473 , H01L25/065
摘要： A semiconductor package includes a semiconductor chip in which a side step or a side slope formed toward an inactive surface from an active surface is included and a width of the active surface is smaller than a width of the inactive surface, and an underfill which is disposed on the active surface and positioned at an inner side of the edge of the semiconductor chip.
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公开(公告)号：US20170234937A1
公开(公告)日：2017-08-17
申请号：US15234417
申请日：2016-08-11
发明人： Seung Won Park , Joon Sub Lee , Seung Won Kang
CPC分类号： G01R31/44 , G01J1/0223 , G01J1/42 , G01J2001/4252
摘要： A testing apparatus includes a plate unit including at least one chip mounting unit on which a light emitting diode (LED) to be tested is mounted. The chip mounting unit has a first region in which the LED is overlaid and a second region surrounding the first region. The first and second electrode pads are disposed in the first region and include respective extension portions extended toward the second region. A probe portion is configured to connect to the extension portions of the first and second electrode pads. A power control unit is configured to selectively apply test power to the LED through the probe portion. A light measuring unit is configured to measure light properties of light emitted by the LED.
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