Substrate treating apparatus
    1.
    发明授权

    公开(公告)号:US10186427B2

    公开(公告)日:2019-01-22

    申请号:US15833184

    申请日:2017-12-06

    IPC分类号: H01L21/311 H01L21/67

    摘要: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.