PRINTED CIRCUIT BOARD AND APPARATUS INCLUDING THE SAME

    公开(公告)号:US20200245448A1

    公开(公告)日:2020-07-30

    申请号:US16652243

    申请日:2018-09-28

    发明人: Yong Hee CHO

    IPC分类号: H05K1/02 H05K1/18 H05K1/11

    摘要: A printed circuit board may comprise a first layer in which a first signal transmission path is formed, a second layer disposed in one surface direction of the first layer and including a first ground for providing a return current path for a signal transmitted from the first layer, a third layer in which a second signal transmission path is formed and a fourth layer disposed in the other surface direction of the third layer and including a second ground for providing a return current path for a signal transmitted from the third layer.