公开(公告)号：US10825775B2

公开(公告)日：2020-11-03

申请号：US16149102

申请日：2018-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam Kang ,  Jin Su Kim ,  Yong Jin Park ,  Young Gwan Ko ,  Yong Jin Seol

IPC: H01L29/00 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L23/367 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor package includes a support member including a resin body having a first surface and a second surface opposing each other and having a cavity, and at least one passive component embedded in the resin body and having a connection terminal exposed from the first surface; a first connection member disposed on the first surface of the resin body, and having a first redistribution layer on the first insulating layer and connected to the connection terminal; a second connection member disposed on the first connection member and covering the cavity, and having a second redistribution layer on the second insulating layer and connected to the first redistribution layer; and a semiconductor chip disposed on the second connection member in the cavity.

公开(公告)号：US10541221B2

公开(公告)日：2020-01-21

申请号：US16010754

申请日：2018-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Jin Seol ,  Myung Sam Kang ,  Young Gwan Ko

IPC: H01L23/52 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H01L23/31

Abstract: A fan-out semiconductor package includes a core member having a through-hole in which a semiconductor chip is disposed. The semiconductor chip has an active surface having connection pads disposed thereon and an inactive surface opposing the active surface. An encapsulant encapsulates at least a portion of the semiconductor chip. A connection member is disposed on the active surface of the semiconductor chip and includes a redistribution layer electrically connected to the connection pads of the semiconductor chip. A passivation layer is disposed on the connection member. The fan-out semiconductor package further has a slot spaced part from the through-hole and penetrating through at least a portion of the core member or the passivation layer.