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公开(公告)号:US11283151B2
公开(公告)日:2022-03-22
申请号:US16202596
申请日:2018-11-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji Hoon Kim , Ji Yong Kim , Jong In Lee , Yeon Jeong Kim , Yong Jun An , Hyo Seok Na
IPC: H01Q1/24 , H01Q1/22 , H01Q23/00 , H01Q21/00 , H01Q9/04 , H01L23/66 , H01P5/18 , H01Q5/335 , H01Q21/06
Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.
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公开(公告)号:US11682827B2
公开(公告)日:2023-06-20
申请号:US17693501
申请日:2022-03-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji Hoon Kim , Ji Yong Kim , Jong In Lee , Yeon Jeong Kim , Yong Jun An , Hyo Seok Na
IPC: H01Q1/24 , H01Q1/22 , H01Q23/00 , H01Q21/00 , H01Q9/04 , H01L23/66 , H01P5/18 , H01Q5/335 , H01Q21/06
CPC classification number: H01Q1/2283 , H01L23/66 , H01P5/187 , H01Q1/24 , H01Q1/243 , H01Q5/335 , H01Q9/0407 , H01Q9/0414 , H01Q21/0031 , H01Q21/0093 , H01Q21/065 , H01Q23/00 , H01L2223/6627 , H01L2223/6677
Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.
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公开(公告)号:US10924065B2
公开(公告)日:2021-02-16
申请号:US16875222
申请日:2020-05-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Min Lee , Yong Jun An , Yu Seon Lee
IPC: H03F1/02 , H04B7/0417 , H03F3/189 , H04W52/52 , H04B17/13
Abstract: An electronic device is provided. The electronic device includes an antenna array configured to include a plurality of antenna modules, a communication circuit configured to include a plurality of power amplifiers connected with the plurality of antenna elements and a plurality of phase shifters, at least one processor operatively connected with the communication circuit, and a memory operatively connected with the at least one processor and includes instructions.
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公开(公告)号:US10658978B2
公开(公告)日:2020-05-19
申请号:US16202842
申请日:2018-11-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Young Min Lee , Yong Jun An , Yu Seon Lee
IPC: H03F1/02 , H04B7/0417 , H03F3/189 , H04W52/52 , H04B17/13
Abstract: An electronic device is provided. The electronic device includes an antenna array configured to include a plurality of antenna modules, a communication circuit configured to include a plurality of power amplifiers connected with the plurality of antenna elements and a plurality of phase shifters, at least one processor operatively connected with the communication circuit, and a memory operatively connected with the at least one processor and includes instructions.
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