公开(公告)号：US20150014860A1

公开(公告)日：2015-01-15

申请号：US14303987

申请日：2014-06-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chul-yong Jang ,  Ae-nee Jang ,  Young-Iyong Kim

IPC: H01L23/538 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package includes a package substrate including a substrate connection pad. At least one semiconductor chip includes at least one redistribution layer. The at least one redistribution layer covers at least a portion of a chip connection pad and extends along an upper surface of the at least one semiconductor chip in a first direction in which the chip connection pad faces toward an edge of the at least one semiconductor chip. At least one interconnection line disposed on a side of the at least one semiconductor chip electrically connects the substrate connection pad to the at least one redistribution layer. The at least one redistribution layer includes a protruding portion protruding from the edge of the at least one semiconductor chip to contact the at least one interconnection line.

Abstract translation: 半导体封装包括包括衬底连接焊盘的封装衬底。 至少一个半导体芯片包括至少一个再分配层。 所述至少一个再分配层覆盖芯片连接焊盘的至少一部分，并且沿着第一方向沿着至少一个半导体芯片的上表面延伸，其中芯片连接焊盘朝向至少一个半导体芯片的边缘 。 设置在所述至少一个半导体芯片的一侧上的至少一个互连线将所述衬底连接焊盘电连接到所述至少一个再分配层。 所述至少一个再分布层包括从所述至少一个半导体芯片的边缘突出以与所述至少一个互连线接触的突出部分。