公开(公告)号：US20240213062A1

公开(公告)日：2024-06-27

申请号：US18534223

申请日：2023-12-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongha Hwang ,  Yusung Jang

IPC: H01L21/67 ,  H01L33/50

CPC classification number: H01L21/67271 ,  H01L33/50 ,  H01L2933/0041

Abstract: A light-emitting diode (LED)-chip sorting device includes a wafer stage configured to load a wafer including a plurality of LED chips thereon, a film stage configured to load a film thereon, a pick-up unit configured to arrange, on the film loaded on the film stage, the plurality of LED chips loaded on the wafer stage, and a controller configured to control the pick-up unit to sequentially pick up the plurality of LED chips from the wafer stage in a preset pick-up direction. The preset pick-up direction is one of a first pick-up direction defined from a center portion of the wafer toward an edge of the wafer, and a second pick-up direction defined from the edge of the wafer toward the center portion of the wafer.