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公开(公告)号:US20210391351A1
公开(公告)日:2021-12-16
申请号:US16901091
申请日:2020-06-15
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Takuma TAKIMOTO , Masayuki HIROI , Akira INOUE
IPC: H01L27/11582 , H01L27/11568 , H01L27/11565 , G11C16/16
Abstract: A semiconductor structure includes a first-conductivity-type well located in a semiconductor substrate, a semiconductor active area region located adjacent to the a first-conductivity-type well, a first transistor including a source region, a drain region, a channel region located between the source region and the drain region, a gate dielectric layer located over the channel region and a gate electrode located over the gate dielectric layer, such that the transistor is located on the semiconductor active area region, and a cutoff gate electrode located over the semiconductor active area region, and between the first transistor and the first-conductivity-type well.
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2.
公开(公告)号:US20200295012A1
公开(公告)日:2020-09-17
申请号:US16887558
申请日:2020-05-29
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Hiroshi NAKATSUJI , Yasuyuki AOKI , Shigeki SHIMOMURA , Akira INOUE , Kazutaka YOSHIZAWA , Hiroyuki OGAWA
IPC: H01L27/11 , H01L21/8234 , H01L21/768
Abstract: Field effect transistors for an SRAM cell can be formed employing n-doped gate electrode portions for p-type pull-up transistors. The SRAM cell includes a first series connection of a first p-type pull-up transistor and a first n-type pull-down transistor located between a power supply source and electrical ground, and a second series connection of a second p-type pull-up transistor and a second n-type pull-down transistor located between the power supply source and the electrical ground. Each gate electrode of the SRAM cell can include a respective n-doped gate electrode portion.
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3.
公开(公告)号:US20200091157A1
公开(公告)日:2020-03-19
申请号:US16130104
申请日:2018-09-13
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Hiroshi NAKATSUJI , Yasuyuki AOKI , Shigeki SHIMOMURA , Akira INOUE , Kazutaka YOSHIZAWA , Hiroyuki OGAWA
IPC: H01L27/11 , H01L21/768 , H01L21/8234
Abstract: Field effect transistors for an SRAM cell can be formed employing n-doped gate electrode portions for p-type pull-up transistors. The SRAM cell includes a first series connection of a first p-type pull-up transistor and a first n-type pull-down transistor located between a power supply source and electrical ground, and a second series connection of a second p-type pull-up transistor and a second n-type pull-down transistor located between the power supply source and the electrical ground. Each gate electrode of the SRAM cell can include a respective n-doped gate electrode portion.
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