公开(公告)号：US20210408344A1

公开(公告)日：2021-12-30

申请号：US17363227

申请日：2021-06-30

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt ,  Alexander Neumeier ,  Robert Hettler

IPC: H01L33/56 ,  H01L33/64 ,  H01L33/32

Abstract: A stable, hermetically sealed, partially optically transparent package for use to protect optoelectronic components is provided. The package has good cooling for the installed circuit elements and is as stable in relation to temperature and UV. The package has a cap with a frame made of a nitride ceramic and a glass element. The frame has an opening and the glass element hermetically closes the opening. The glass is fused onto the nitride ceramic and is fixed in contact with the nitride ceramic of the frame.

公开(公告)号：US20210384384A1

公开(公告)日：2021-12-09

申请号：US17341228

申请日：2021-06-07

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt ,  Alexander Neumeier ,  Robert Hettler

IPC: H01L33/48 ,  H01L33/62

Abstract: An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.

公开(公告)号：US11870013B2

公开(公告)日：2024-01-09

申请号：US17341228

申请日：2021-06-07

Applicant: SCHOTT AG

Inventor： Frank Gindele ,  Christian Rakobrandt ,  Alexander Neumeier ,  Robert Hettler

IPC: H01L33/48 ,  H01L33/62 ,  H01L21/56 ,  H01L23/538

CPC classification number: H01L33/483 ,  H01L21/56 ,  H01L23/5389 ,  H01L33/62 ,  H01L2924/15 ,  H01L2933/0033

Abstract: An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.