公开(公告)号：US20210066071A1

公开(公告)日：2021-03-04

申请号：US16960106

申请日：2018-11-19

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Pohling THEN ,  Kenji KOBAYASHI ,  Sadamu FUJII ,  Taiki HINODE

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/3105

Abstract: A substrate processing method and a substrate processing apparatus are provided, which solve problems of pattern collapse and particles. The substrate processing method includes: a surface modification step of modifying a surface of a substrate having an oxide thereon to improve or reduce roughness of the surface; a surface cleaning step of supplying a treatment liquid to the modified surface of the substrate to clean the surface of the substrate with the treatment liquid; and a hydrophobization step of supplying a hydrophobizing agent to the cleaned surface of the substrate to hydrophobize the surface of the substrate.