SUBSTRATE TREATMENT SYSTEM
    1.
    发明申请

    公开(公告)号:US20250029861A1

    公开(公告)日:2025-01-23

    申请号:US18755641

    申请日:2024-06-26

    Abstract: In a substrate treatment system, a stocker device, a single-wafer treatment device, an interface device, and a batch treatment device are disposed in a line and linearly in this order. A first transport robot of the stocker device transports a carrier placed on a load port to a stocker device side position. A carrier transport mechanism transports the carrier from the stocker device side position to an interface device side position. A second transport robot of the interface device transports the carrier from the interface device side position to a shelf. The batch treatment device takes out a plurality of substrates from the carrier transported to the shelf, and performs predetermined batch treatment on the plurality of taken-out substrates. The single-wafer treatment device performs treatment on a plurality of substrates one by one.

    SUBSTRATE PROCESSING SYSTEM
    3.
    发明申请

    公开(公告)号:US20250038028A1

    公开(公告)日:2025-01-30

    申请号:US18784170

    申请日:2024-07-25

    Abstract: A substrate processing system includes a transfer device provided with a shelf, a batch processing device, and a single-wafer processing device. The transfer device, the single-wafer processing device, and the batch processing device are linearly arranged in a row, in the order listed herein. The batch processing device includes a first batch transport mechanism that transports a plurality of substrates to a batch process bath, for example, all at once. The first batch transport mechanism receives the plurality of substrates converted into the vertical orientation on the transfer device side, and transports the substrates to, for example, a batch process bath directly, without using a substrate transport robot in the single-wafer processing device.

    SUBSTRATE TREATMENT SYSTEM
    4.
    发明申请

    公开(公告)号:US20250006536A1

    公开(公告)日:2025-01-02

    申请号:US18755643

    申请日:2024-06-26

    Abstract: A substrate treatment system includes a batch treatment device, a single-wafer treatment device, and an interface device that connects the batch treatment device and the single-wafer treatment device. The batch treatment device extends to a rear side. The single-wafer treatment device faces the batch treatment device to be aligned in a width direction orthogonal to the rear side. The interface device is disposed adjacent to one end side of each of the batch treatment device and the single-wafer treatment device to extend in the width direction. The batch substrate transport region of the batch treatment device is disposed adjacent to a transfer block and a treatment block on a side where the single-wafer treatment device is disposed. The interface device includes a posture turning region and a relay region. The posture turning region is disposed on an opposite side to the treatment block via the transfer block.

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