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公开(公告)号：US10892711B2
公开(公告)日：2021-01-12
申请号：US16745803
申请日：2020-01-17
发明人： Norio Nomura
摘要： An oscillator includes a first resonator element, a first circuit element configured to oscillate the first resonator element to generate a first oscillation signal, a first package which is configured to house the first resonator element and the first circuit element, and has a mounting surface and a mounting terminal disposed on the mounting surface, a second resonator element an oscillation frequency of which is controlled based on the first oscillation signal, and a second package which houses the second resonator element and is provided with the second package mounted on the mounting surface of the first package.
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公开(公告)号：US20220311414A1
公开(公告)日：2022-09-29
申请号：US17700605
申请日：2022-03-22
发明人： Norio Nomura
摘要： A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.
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公开(公告)号：US20220302894A1
公开(公告)日：2022-09-22
申请号：US17696152
申请日：2022-03-16
发明人： Norio Nomura
摘要： A resonator device includes: a resonator element; a first package accommodating the resonator element; a heater bonded to the first package; and a second package accommodating the first package and the heater. The first package includes: a base substrate that has a first surface on which the resonator element is disposed and a second surface in a front-back relation with the first surface, and that contains single crystal silicon; an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor; and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.
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公开(公告)号：US11689184B2
公开(公告)日：2023-06-27
申请号：US17700605
申请日：2022-03-22
发明人： Norio Nomura
CPC分类号： H03H9/19 , H03H9/02566 , H03H9/0538 , H03H9/08
摘要： A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.
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公开(公告)号：US11056636B2
公开(公告)日：2021-07-06
申请号：US16774613
申请日：2020-01-28
发明人： Norio Nomura
IPC分类号： H03B1/00 , H01L41/053 , H03B5/32
摘要： An oscillator includes a substrate having a first substrate main surface and a substrate side surface, and a lid body bonded to the substrate and including a metal material, in which the substrate includes a substrate body having a first substrate body main surface corresponding to the first substrate main surface and a substrate body side surface corresponding to the substrate side surface, and provided with a cutout portion in the substrate body side surface, a side surface wiring provided along the cutout portion, a filling member provided in the cutout portion, and an insulating coating member provided on the first substrate body main surface.
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