公开(公告)号：US20230421131A1

公开(公告)日：2023-12-28

申请号：US18462838

申请日：2023-09-07

申请人： Murata Manufacturing Co., Ltd.

发明人： Masakazu FUKUMITSU ,  Naoto YATANI ,  Ryota KAWAI ,  Fumiya ENDOU

IPC分类号： H03H9/17 ,  H03H9/05 ,  H03H9/09 ,  H03H3/02

CPC分类号： H03H9/171 ,  H03H9/0538 ,  H03H9/09 ,  H03H3/02

摘要： A method is provided for manufacturing a resonance device, the method includes forming a recessed portion that forms a vibration space for a resonator in an object that is at least one of an upper lid and a lower lid and includes etching on the object by isotropic etching while the object is covered with a mask having a peripheral portion having a frame shape and a stopper formation that extends from the peripheral portion toward an inside of the peripheral portion. The method further includes etching the object while the object is covered with the mask to form a stopper at a position overlapping with the stopper formation on a bottom surface of the recessed portion in a plan view of the object. In this aspect, the stopper restricts collision of the resonator with the bottom surface of the recessed portion.

公开(公告)号：US11689184B2

公开(公告)日：2023-06-27

申请号：US17700605

申请日：2022-03-22

申请人： SEIKO EPSON CORPORATION

发明人： Norio Nomura

IPC分类号： H03H9/19 ,  H03H9/02 ,  H03H9/08 ,  H03H9/05

CPC分类号： H03H9/19 ,  H03H9/02566 ,  H03H9/0538 ,  H03H9/08

摘要： A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.

公开(公告)号：US20180151622A1

公开(公告)日：2018-05-31

申请号：US15494272

申请日：2017-04-21

申请人： Silterra Malaysia Sdn. Bhd.

发明人： Mohanraj Soundara Pandian ,  Wee Song Tay ,  Venkatesh Madhaven ,  Arjun Kumar Kantimahanti

IPC分类号： H01L27/20 ,  H03H9/17 ,  H03H9/25 ,  B81C1/00

CPC分类号： H01L27/20 ,  B81B2201/0271 ,  B81B2207/015 ,  B81C1/00246 ,  H03H9/0538 ,  H03H9/173 ,  H03H9/25

摘要： Monolithic integrated device having an architecture that allows an acoustic device to transduce either surface acoustic waves or bulk acoustic waves, comprising: a substrate layer being the base of the device; an inter-layer dielectric disposed on top of the substrate layer; an electronic circuitry substantially formed in the inter-layer dielectric and supported by the substrate layer, the electronic circuitry comprises a plurality of metal layers; and a piezoelectric layer being sandwiched between a top electrode and a bottom electrode within the inter-layer dielectric. The top electrode is an upper metal layer belonging to the electronic circuitry and the bottom electrode is a lower metal layer belonging to the electronic circuitry. To transduce the bulk acoustic waves, the inter-layer dielectric is formed with a top cavity above the top electrode and a bottom cavity below the bottom electrode.

公开(公告)号：US09876157B2

公开(公告)日：2018-01-23

申请号：US14331232

申请日：2014-07-15

申请人： NIHON DEMPA KOGYO CO., LTD.

发明人： Akihiro Kanamaru ,  Takuya Kuwayama ,  Yasunori Hosokawa

IPC分类号： H01L41/08 ,  H01L41/053 ,  H03H9/05 ,  H03H9/10

CPC分类号： H01L41/053 ,  H03H9/0538 ,  H03H9/0552 ,  H03H9/1021

摘要： A surface mount type quartz crystal device according to a first aspect of the disclosure includes a ceramic package, a pedestal blank, a quartz-crystal vibrating piece. The pedestal blank is placed within the ceramic package via a conductive adhesive. The quartz-crystal vibrating piece is placed on the pedestal blank. The conductive adhesive is formed along an outer peripheral side of the pedestal blank so as to avoid overlap with the excitation electrode viewed in a normal direction of the excitation electrode. The pedestal blank is formed to avoid a region where a distance from the quartz-crystal vibrating piece is equal to or smaller than a size of a clearance between the pedestal blank and the quartz-crystal vibrating piece at the outer peripheral side, in a region where the excitation electrode faces at the pedestal blank side viewed in the normal direction.

公开(公告)号：US20170310299A1

公开(公告)日：2017-10-26

申请号：US15639495

申请日：2017-06-30

申请人： X-Celeprint Limited

发明人： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok ,  Robert R. Rotzoll

IPC分类号： H03H9/17 ,  H03H9/145 ,  H03H9/13 ,  H03H9/02 ,  H03H9/58 ,  H03H9/00

CPC分类号： H03H9/172 ,  H03H3/02 ,  H03H3/08 ,  H03H9/0095 ,  H03H9/02015 ,  H03H9/02062 ,  H03H9/02157 ,  H03H9/02543 ,  H03H9/02779 ,  H03H9/02921 ,  H03H9/0504 ,  H03H9/0509 ,  H03H9/0538 ,  H03H9/132 ,  H03H9/14505 ,  H03H9/173 ,  H03H9/175 ,  H03H9/545 ,  H03H9/564 ,  H03H9/583 ,  H03H9/64 ,  H03H2009/02496

摘要： A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.

公开(公告)号：US20170214384A1

公开(公告)日：2017-07-27

申请号：US15087354

申请日：2016-03-31

申请人： RF Micro Devices, Inc.

发明人： Kushal Bhattacharjee

IPC分类号： H03H9/13 ,  H03H9/15 ,  H03H9/02 ,  H03H9/00

CPC分类号： H03H9/02228 ,  H03H3/0072 ,  H03H3/0077 ,  H03H3/02 ,  H03H3/08 ,  H03H9/0009 ,  H03H9/02244 ,  H03H9/02259 ,  H03H9/02275 ,  H03H9/02338 ,  H03H9/02787 ,  H03H9/0296 ,  H03H9/0538 ,  H03H9/13 ,  H03H9/131 ,  H03H9/145 ,  H03H9/14564 ,  H03H9/15 ,  H03H9/17 ,  H03H9/25 ,  H03H2003/027 ,  H03H2009/02165 ,  H03H2009/02496 ,  H03H2009/155

摘要： A micro-electrical-mechanical system (MEMS) guided wave device includes a plurality of electrodes arranged below a piezoelectric layer (e.g., either embedded in a slow wave propagation layer or supported by a suspended portion of the piezoelectric layer) and configured for transduction of a lateral acoustic wave in the piezoelectric layer. The piezoelectric layer permits one or more additions or modifications to be made thereto, such as trimming (thinning) of selective areas, addition of loading materials, sandwiching of piezoelectric layer regions between electrodes to yield capacitive elements or non-linear elastic convolvers, addition of sensing materials, and addition of functional layers providing mixed domain signal processing utility.

公开(公告)号：US20160099702A1

公开(公告)日：2016-04-07

申请号：US14874514

申请日：2015-10-05

申请人： Teknologian tutkimuskeskus VTT Oy

发明人： Antti Jaakkola ,  Panu Pekko ,  Mika Prunnila ,  Tuomas Pensala

IPC分类号： H03H9/02 ,  H03H9/05 ,  H03H9/24

CPC分类号： H03H9/02448 ,  H03H9/0538 ,  H03H9/2405 ,  H03H2009/02527 ,  H03H2009/241 ,  H03H2009/2442

摘要： The invention concerns microelectromechanical resonators. In particular, the invention provides a resonator comprising a support structure, a doped semiconductor resonator suspended to the support structure by at least one anchor, and actuator for exciting resonance into the resonator. According to the invention, the resonator comprises a base portion and at least one protrusion extending outward from the base portion and is excitable by said actuator into a compound resonance mode having temperature coefficient of frequency (TCF) characteristics, which are contributed by both the base portion and the at least one protrusion. The invention enables simple resonators, which are very well temperature compensated over a wide temperature range.

摘要翻译： 本发明涉及微机电谐振器。 特别地，本发明提供了一种谐振器，其包括支撑结构，通过至少一个锚悬置到支撑结构的掺杂半导体谐振器，以及用于激励谐振到谐振器的致动器。 根据本发明，谐振器包括基部和从基部向外延伸的至少一个突起，并且可由所述致动器激发成具有频率（TCF）特性温度系数的复合谐振模式，这两者均由基极 部分和所述至少一个突起。 本发明实现了简单的谐振器，其在宽的温度范围内被很好的温度补偿。

公开(公告)号：US20140354374A1

公开(公告)日：2014-12-04

申请号：US14463441

申请日：2014-08-19

申请人： TAIYO YUDEN CO., LTD.

发明人： Osamu KAWACHI ,  Kensei UEHARA

IPC分类号： H03H9/72

CPC分类号： H03H9/0538 ,  H01L2224/16225 ,  H01L2924/181 ,  H03H9/02535 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/0561 ,  H03H9/0566 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1071 ,  H03H9/1085 ,  H03H9/725 ,  H03H2009/0019 ,  H01L2924/00012

摘要： An acoustic wave device includes: a first chip that includes a first substrate, and a first filter formed on a first surface of the first substrate; and a second chip that includes a second substrate, and a second filter formed on a second surface of the second substrate, the second surface being located in a plane different from the first surface.

摘要翻译： 声波装置包括：第一芯片，包括第一基板和形成在第一基板的第一表面上的第一滤波器; 以及第二芯片，其包括第二基板和形成在所述第二基板的第二表面上的第二过滤器，所述第二表面位于与所述第一表面不同的平面中。

公开(公告)号：US08736149B2

公开(公告)日：2014-05-27

申请号：US13712227

申请日：2012-12-12

申请人： Taiyo Yuden Co., Ltd.

发明人： Kazunori Inoue ,  Masafumi Iwaki ,  Tsutomu Miyashita ,  Kazuhiro Matsumoto

IPC分类号： H03H9/25 ,  H03H9/10 ,  H03H3/02

CPC分类号： H03H9/1071 ,  H01L23/3114 ,  H01L23/315 ,  H01L41/053 ,  H01L2924/0002 ,  H03H3/02 ,  H03H3/08 ,  H03H9/0538 ,  H03H9/059 ,  H03H9/25 ,  H03H9/542 ,  H05K1/181 ,  H05K3/007 ,  Y10T29/49124 ,  H01L2924/00

摘要： An electronic component includes: an element that is located on a substrate; a signal wiring that is located on the substrate and electrically connected to the element; a metal plate that is located so as to form a cavity on a functional part of the element and covers an upper surface of the cavity; a support post that is located on the substrate so as not to be located on the signal wiring, and supports the metal plate; and an insulating portion that covers the metal plate and the support post, and contacts a side surface of the cavity.

摘要翻译： 电子部件包括：位于基板上的元件; 信号线，其位于所述基板上并与所述元件电连接; 金属板，其被定位成在所述元件的功能部分上形成空腔并覆盖所述空腔的上表面; 支撑柱，其位于所述基板上，以便不位于所述信号布线上，并且支撑所述金属板; 以及覆盖金属板和支撑柱的绝缘部分，并且与空腔的侧表面接触。

公开(公告)号：US20090200900A1

公开(公告)日：2009-08-13

申请号：US11814797

申请日：2006-01-25

申请人： Yasuhiro Nakai ,  Kenji Yamakawa

发明人： Yasuhiro Nakai ,  Kenji Yamakawa

IPC分类号： H01L41/047

CPC分类号： H03H9/177 ,  H03H9/0538 ,  H03H9/1035

摘要： A piezoelectric oscillation element (1) comprising a piezoelectric substrate (10), a first conductor film (21) formed on one main surface of the piezoelectric substrate (10), a second conductor film (22) formed on the other main surface, and grounding terminals (31a, 31b) formed on the side surfaces of the piezoelectric substrate (10). Specified capacitances are respectively formed between the first and second conductor films (21, 22) formed on the main surfaces of the piezoelectric substrate (10) and the grounding terminals (31a, 31b) formed on the side surfaces thereof. Larger capacitances can be formed than when electrodes are disposed on the same main surface in proximity of each other to form a capacitance, whereby no adverse effect is given to thickness vibration occurring between the first and second conductor films (21, 22).

摘要翻译： 一种压电振动元件（1），包括压电基板（10），形成在压电基板（10）的一个主表面上的第一导体膜（21），形成在另一主表面上的第二导体膜（22） 形成在压电基板（10）的侧面上的接地端子（31a，31b）。 分别在形成在压电基板（10）的主表面上的第一和第二导体膜（21,22）和形成在其侧表面上的接地端子（31a，31b）之间形成指定电容。 可以形成比在彼此靠近的电极设置在同一主表面上以形成电容的电容量大，从而不会对在第一和第二导体膜（21,22）之间产生的厚度振动产生不利影响。