Resonator Element And Resonator Device
    2.
    发明公开

    公开(公告)号:US20240297636A1

    公开(公告)日:2024-09-05

    申请号:US18592642

    申请日:2024-03-01

    IPC分类号: H03H9/215 H03H9/19

    CPC分类号: H03H9/215 H03H9/19

    摘要: A resonator element includes a base part and a vibrating arm. The vibrating arm includes an arm part and a wide part whose width is larger than that of the arm part. In the arm part, a first groove is formed on the first surface side, and a second groove is formed on the second surface side. 30 μm≤Wa≤75 μm, in which a width of the arm part is Wa, a thickness T between the first surface and the second surface of the arm part satisfies 110 μm≤T≤150 μm. 0.884≤(t1+t2)/T≤0.990, in which a depth of the first groove is t1, and a depth of the second groove is t2. 0.0056≤Wb/T≤0.0326, in which a width of the first surface arranged across the first groove and a width of the second surface arranged across the second groove are Wb. A length L1 of the vibrating arm satisfies L1≤1000 μm.

    CRYSTAL RESONATOR AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240267026A1

    公开(公告)日:2024-08-08

    申请号:US18280969

    申请日:2022-03-10

    IPC分类号: H03H9/19 H03B5/32 H03H3/04

    摘要: In a crystal resonator (100), a crystal resonator plate (10) includes: a vibrating part (11); an external frame part (12) provided at a side of an outer periphery of the vibrating part (11); and a penetrating part (10a) provided between the vibrating part (11) and the external frame part (12) so as to penetrate the crystal resonator plate (10) in a thickness direction of the crystal resonator plate (10). An inclined surface (11c) is provided at an end part of the vibrating part (11) at the side of the penetrating part (10a) so as to protrude in the thickness direction and to be inclined with respect to a vibrating surface (11b) of the vibrating part (11).

    PIEZOELECTRIC RESONATOR PLATE AND PIEZOELECTRIC RESONATOR DEVICE

    公开(公告)号:US20240267020A1

    公开(公告)日:2024-08-08

    申请号:US18563142

    申请日:2022-06-22

    IPC分类号: H03H9/02 H03H9/10 H03H9/19

    摘要: A crystal resonator plate according to one or more embodiments may include: a vibrating part; an external frame part surrounding an outer periphery of the vibrating part; and a support part connecting the vibrating part to the external frame part. A plurality of crystal faces is formed on respective side surfaces of the external frame part and the support part. The respective side surfaces are connected to a connecting part of the external frame part and the support part. A plurality of ridge lines is formed by the plurality of crystal faces. An intersection blocking part is provided on the connecting part of the external frame part and the support part, on at least one side of a first main surface side and a second main surface side thereof, to block intersection of two or more of the ridge lines on the connecting part.

    VIBRATOR DEVICE
    5.
    发明公开
    VIBRATOR DEVICE 审中-公开

    公开(公告)号:US20240258988A1

    公开(公告)日:2024-08-01

    申请号:US18427344

    申请日:2024-01-30

    摘要: A vibrator device includes: a base including a semiconductor substrate having an integrated circuit disposed at a first surface; a vibration element electrically coupled to the integrated circuit; and a lid having an end surface of a side wall bonded to the first surface at a bonding portion. A first circuit of the integrated circuit includes a first circuit element disposed in a first region overlapping the bonding portion in a plan view. The first circuit element is a passive element or a transistor, and θ

    RESONATOR DEVICE
    6.
    发明公开
    RESONATOR DEVICE 审中-公开

    公开(公告)号:US20240213952A1

    公开(公告)日:2024-06-27

    申请号:US18392809

    申请日:2023-12-21

    IPC分类号: H03H9/10 H03H3/02 H03H9/19

    CPC分类号: H03H9/1021 H03H3/02 H03H9/19

    摘要: A resonator device includes: a base substrate having a first surface and a second surface in a front-to-back relationship with the first surface; a resonator element located on a first surface side of the base substrate and including a resonator substrate and an electrode terminal disposed at a base-substrate-side surface of the resonator substrate; a mounting terminal disposed at the first surface; and a metal bump disposed between the base substrate and the resonator element, the metal bump being configured to bond the base substrate and the resonator element and electrically couple the mounting terminal and the electrode terminal. A cross-sectional area of the metal bump at a bonding portion with the resonator element is 491 μm2 or more and 4007 μm2 or less.

    Resonator Device
    7.
    发明公开
    Resonator Device 审中-公开

    公开(公告)号:US20240204745A1

    公开(公告)日:2024-06-20

    申请号:US18539418

    申请日:2023-12-14

    发明人: Manabu SHIRAKI

    IPC分类号: H03H9/05 H03H9/10 H03H9/19

    摘要: Provided is a resonator device in which an inner wall of a case accommodating a piezoelectric substrate includes a first inner wall and a second inner wall that intersect at a corner at which a coupling electrode is located, the piezoelectric substrate has a first surface facing a bottom surface of the case, a second surface opposite to the first surface, a first side surface facing the first inner wall, and a second side surface facing the second inner wall, an extension electrode formed at the piezoelectric substrate includes a first side surface electrode overlapping the first side surface and a second side surface electrode overlapping the second side surface, a conductive adhesive reaches the first side surface electrode and the second side surface electrode of the piezoelectric substrate from the coupling electrode formed at the case, bonds the first side surface electrode and the first inner wall, and bonds the second side surface electrode and the second inner wall.

    Circuit device and oscillator
    8.
    发明授权

    公开(公告)号:US12003216B2

    公开(公告)日:2024-06-04

    申请号:US17562065

    申请日:2021-12-27

    发明人: Takehiro Yamamoto

    IPC分类号: H03B28/00 G06F1/02 H03H9/19

    摘要: A circuit device includes an oscillation circuit which is electrically coupled to a first node to electrically be coupled to one end of a resonator and a second node to electrically be coupled to another end of the resonator, and is configured to oscillate the resonator to generate an oscillation signal, and a waveform shaping circuit which is coupled to the first node, to which the oscillation signal is input from the first node, and which is configured to output a clock signal obtained by performing waveform shaping on the oscillation signal, and a duty adjustment circuit configured to supply the first node with a bias voltage which is variably adjusted based on adjustment data to thereby adjust a duty ratio of the clock signal.

    METHOD FOR MANUFACTURING VIBRATOR
    9.
    发明公开

    公开(公告)号:US20240088859A1

    公开(公告)日:2024-03-14

    申请号:US18457844

    申请日:2023-08-29

    IPC分类号: H03H3/02 H03H9/19

    CPC分类号: H03H3/02 H03H9/19

    摘要: A method for manufacturing a vibrator includes: a preparation process of preparing a quartz-crystal wafer including a vibrator and a holding portion, the vibrator including a support portion and a vibration part arranged side by side along a first direction, the holding portion being coupled to one end portion of the support portion in a second direction intersecting the first direction; an adhering process of fixing at least the support portion and the holding portion of the quartz-crystal wafer to a film via an adhesive; and a singulation process of stretching the film along the second direction, and separating and singulating the vibrator from the holding portion.

    PIEZOELECTRIC RESONATOR DEVICE
    10.
    发明公开

    公开(公告)号:US20240039505A1

    公开(公告)日:2024-02-01

    申请号:US18265690

    申请日:2021-12-13

    IPC分类号: H03H9/02 H03H9/10 H03H9/19

    摘要: A piezoelectric resonator device according to one or more embodiments may be provided, in which a crystal resonator plate includes a cutout part between a vibrating part and an external frame part, and a metal film formed on a first main surface of a first sealing member is electrically connected to an external electrode terminal formed on a second main surface, which does not face an internal space, of a second sealing member via a first internal wiring formed on an inner wall surface of the external frame part.