公开(公告)号：US20230245936A1

公开(公告)日：2023-08-03

申请号：US18010288

申请日：2021-06-18

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Taro SHIOJIMA ,  Kenichiro SATO ,  Hidenobu DEGUCHI ,  Hideaki ISHIZAWA ,  Munehiro HATAI ,  Tokushige SHICHIRI

IPC: H01L23/29 ,  C08G77/44 ,  C09J5/02 ,  C09J183/10 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/296 ,  C08G77/44 ,  C09J5/02 ,  C09J183/10 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L24/03 ,  H01L21/56 ,  C08G77/80

Abstract: The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.