公开(公告)号：US20230245936A1

公开(公告)日：2023-08-03

申请号：US18010288

申请日：2021-06-18

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Taro SHIOJIMA ,  Kenichiro SATO ,  Hidenobu DEGUCHI ,  Hideaki ISHIZAWA ,  Munehiro HATAI ,  Tokushige SHICHIRI

IPC: H01L23/29 ,  C08G77/44 ,  C09J5/02 ,  C09J183/10 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/296 ,  C08G77/44 ,  C09J5/02 ,  C09J183/10 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L24/03 ,  H01L21/56 ,  C08G77/80

Abstract: The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.

公开(公告)号：US20220162480A1

公开(公告)日：2022-05-26

申请号：US17439576

申请日：2020-03-19

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Tokushige SHICHIRI

IPC: C09J7/35 ,  C09J179/08 ,  H01L21/683

Abstract: The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.

公开(公告)号：US20250051573A1

公开(公告)日：2025-02-13

申请号：US18720896

申请日：2022-12-22

Applicant: Sekisui Chemical Co., Ltd

Inventor： Hayate NOMOTO ,  Taro SHIOJIMA ,  Tokushige SHICHIRI ,  Kenichiro SATO ,  Hidenobu DEGUCHI

IPC: C08L83/12 ,  C08J5/18 ,  H01L27/146

Abstract: The present invention aims to provide a curable resin composition capable of forming a film which, even when made thick, is less likely to crack at high temperature under a nitrogen atmosphere, a cured film formed using the curable resin composition, a stack including the cured film, an imaging device including the stack, an semiconductor device including the stack, a method for producing the stack, and a method for producing an element including a bonding electrode for use in production of the stack. Provided is a curable resin composition containing: a polyimide; and a silsesquioxane, the polyimide being contained in an amount of 0.5 parts by weight or more and 50 parts by weight or less relative to 100 parts by weight of the silsesquioxane.

公开(公告)号：US20230312923A1

公开(公告)日：2023-10-05

申请号：US18025232

申请日：2021-09-22

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Toshio TAKAHASHI ,  Tokushige SHICHIRI ,  Satoshi HAYASHI ,  Izumi DAIDO ,  Fumika HOSHINO

IPC: C08L79/08 ,  C08K5/3415 ,  C09J179/08

CPC classification number: C08L79/08 ,  C08K5/3415 ,  C09J179/08

Abstract: The present invention aims to provide a curable resin composition that can reduce the occurrence of voids and partial detachment between the composition and a support even in high-temperature processing at 300° C. or higher with an adherend fixed to the support with the composition, and is easily separable after the high-temperature processing. The present invention also aims to provide a temporary fixing material including an adhesive layer containing the curable resin composition and a method of producing an electronic component using the temporary fixing material. Provided is a curable resin composition containing: a maleimide group-containing reactive compound (1); and a resin (2) having an imide skeleton in a backbone repeating unit.

公开(公告)号：US20250054895A1

公开(公告)日：2025-02-13

申请号：US18722920

申请日：2022-12-22

Applicant: Sekisui Chemical Co., Ltd.

Inventor： Taro SHIOJIMA ,  Hayate NOMOTO ,  Kenichiro SATO ,  Hidenobu DEGUCHI ,  Tokushige SHICHIRI

IPC: H01L23/00 ,  C09D183/06 ,  H01L27/146

Abstract: The present invention aims to provide a curable resin composition that can planarize bonding surfaces and connect elements without leaving surface voids even when the elements have irregularities on the surface, thus imparting high bonding reliability between the elements, a cured film formed using the curable resin composition, a stack including the cured film, an imaging device including the stack, an semiconductor device including the stack, a method for producing the stack, and a method for producing an element including a bonding electrode for use in production of the stack. Provided is a curable resin composition containing: an organosilicon compound; and a solvent, the curable resin composition having a viscosity at 25° C. of 2,000 cP or less, the solvent being contained in an amount of 50% by weight or less in the curable resin composition, the curable resin composition having an adhesion of a score of 0 to 2 as measured by a cross-cut method in conformity with JIS K5600-5-6 using a measurement sample obtained by spin-coating a silicon wafer with the composition, evaporating the solvent, and then heat curing at 300° C. for one hour to form a film.

公开(公告)号：US20230348767A1

公开(公告)日：2023-11-02

申请号：US18025730

申请日：2021-09-22

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Izumi DAIDO ,  Toshio TAKAHASHI ,  Tokushige SHICHIRI ,  Satoshi HAYASHI ,  Fumika HOSHINO

IPC: C09J11/04 ,  C09J179/08 ,  C09J11/08

CPC classification number: C09J179/08 ,  C09J11/04 ,  C09J11/08 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/502

Abstract: The present invention aims to provide a temporary fixing material that is easily separable even after high-temperature processing at 300° C. or higher with an adherend fixed thereon. The present invention also aims to provide a method for producing an electronic component using the temporary fixing material. Provided is a temporary fixing material containing a photocurable adhesive, the photocurable adhesive containing a reactive resin containing a resin (1) having an imide skeleton in a backbone repeating unit, the temporary fixing material having a light transmittance at 405 nm of 10% or greater and a 5% weight loss temperature of 350° C. or higher.