公开(公告)号：US20210147739A1

公开(公告)日：2021-05-20

申请号：US17059326

申请日：2019-05-31

Applicant: Sekisui Chemical Co., Ltd.

Inventor： Masataka SUGIMOTO ,  Abison SCARIA ,  Taku SASAKI ,  Hidehito NISHIZAWA ,  Masafumi YOSHIDA ,  Takaaki MIZUNO ,  Motoki OZAWA ,  Tsukasa ISHIGAKI ,  Hiroki KUDOH

IPC: C09K5/14 ,  C08G77/20 ,  C08G59/56 ,  C08K3/04 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06 ,  C08K7/18 ,  C08K13/06

Abstract: The heat-dissipating composition according to the present invention comprises a polymer matrix and diamond particles. The present invention provides the heat-dissipating composition compatibly satisfying both electric insulativity and heat dissipativity.

公开(公告)号：US20220389300A1

公开(公告)日：2022-12-08

申请号：US17770490

申请日：2020-10-22

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Masataka SUGIMOTO ,  Osamu INUI ,  Izumi MATSUMOTO ,  Tetsurou YOSHIOKA ,  Abison SCARIA

IPC: C09K5/14 ,  C08K3/04

Abstract: There is provided a resin composition containing a resin component and diamond particles, the diamond particles having the total metal content constituted from iron, nickel, cobalt, and chromium of 5 ppm or higher and 300 ppm or lower.

公开(公告)号：US20210214233A1

公开(公告)日：2021-07-15

申请号：US15733986

申请日：2019-06-04

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Masataka SUGIMOTO ,  Taku SASAKI ,  Abison SCARIA ,  Hidehito NISHIZAWA

IPC: C01B32/26 ,  C08L101/00

Abstract: The diamond particle according to the present invention has an ionic conductivity Di represented by the following expression of 0.8 mS/m or lower: Di=Ds−Dw wherein Ds represents an ionic conductivity of an aqueous solution obtained by dissolving-out in a pressure cooker test carried out according to IEC68-2-66; and Dw represents an ionic conductivity of distilled water.