公开(公告)号：US20230151216A1

公开(公告)日：2023-05-18

申请号：US17916632

申请日：2021-04-05

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Tetsurou YOSHIOKA ,  Osamu INUI ,  Hidehito NISHIZAWA ,  Izumi MATSUMOTO ,  Abison SCARIA

IPC: C08L83/04 ,  C08K3/04

CPC classification number: C08L83/04 ,  C08K3/04 ,  C08K2201/001 ,  C08K2003/2227

Abstract: A resin composition of the present invention comprises: a silicone resin or a silicone oil (A), a compound (B) having a particular structure, and a thermally conductive filler (C). According to the present invention, a resin composition having favorable thermally conductive properties and exhibiting small physical property changes at high temperatures can be provided.

公开(公告)号：US20220389300A1

公开(公告)日：2022-12-08

申请号：US17770490

申请日：2020-10-22

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Masataka SUGIMOTO ,  Osamu INUI ,  Izumi MATSUMOTO ,  Tetsurou YOSHIOKA ,  Abison SCARIA

IPC: C09K5/14 ,  C08K3/04

Abstract: There is provided a resin composition containing a resin component and diamond particles, the diamond particles having the total metal content constituted from iron, nickel, cobalt, and chromium of 5 ppm or higher and 300 ppm or lower.