公开(公告)号：US20230151216A1

公开(公告)日：2023-05-18

申请号：US17916632

申请日：2021-04-05

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Tetsurou YOSHIOKA ,  Osamu INUI ,  Hidehito NISHIZAWA ,  Izumi MATSUMOTO ,  Abison SCARIA

IPC: C08L83/04 ,  C08K3/04

CPC classification number: C08L83/04 ,  C08K3/04 ,  C08K2201/001 ,  C08K2003/2227

Abstract: A resin composition of the present invention comprises: a silicone resin or a silicone oil (A), a compound (B) having a particular structure, and a thermally conductive filler (C). According to the present invention, a resin composition having favorable thermally conductive properties and exhibiting small physical property changes at high temperatures can be provided.

公开(公告)号：US20200216659A1

公开(公告)日：2020-07-09

申请号：US16623108

申请日：2018-06-21

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Yuko KAWAHARA ,  Keigo OOWASHI ,  Kouji ASHIBA ,  Rui ZHANG ,  Osamu INUI ,  Hiroshi MAENAKA

IPC: C08L63/00 ,  B32B27/18

Abstract: Provided is a resin material capable of effectively enhancing adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio of more than 2, and a binder resin, an absolute value of a difference between an average particle diameter of the first inorganic particles and an average major diameter of the second inorganic particles is 10 μm or less, the average particle diameter of the first inorganic particles is 1 μm or more and less than 20 μm, the average major diameter of the second inorganic particles is 2 μm or more, and the content of the second inorganic particles is more than 40% by volume relative to 100% by volume of sum of the first inorganic particles and the second inorganic particles.

公开(公告)号：US20220389300A1

公开(公告)日：2022-12-08

申请号：US17770490

申请日：2020-10-22

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Masataka SUGIMOTO ,  Osamu INUI ,  Izumi MATSUMOTO ,  Tetsurou YOSHIOKA ,  Abison SCARIA

IPC: C09K5/14 ,  C08K3/04

Abstract: There is provided a resin composition containing a resin component and diamond particles, the diamond particles having the total metal content constituted from iron, nickel, cobalt, and chromium of 5 ppm or higher and 300 ppm or lower.