公开(公告)号：US20210202296A1

公开(公告)日：2021-07-01

申请号：US17138427

申请日：2020-12-30

Applicant: SEMES CO., LTD.

Inventor： Sukhwan CHI ,  Kyo Sang YOON ,  Bo Hee LEE ,  Byoungdoo CHOI

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: A method for lifting a substrate includes raising the substrate off a support plate having the substrate placed thereon, by using a lift pin, in which the lift pin raises the substrate off the support plate while vertically moving between a lowered position spaced apart downward from the support plate by a first distance and a raised position spaced apart upward from the support plate by a second distance, and the lift pin is brought into contact with the substrate in an interval in which the lift pin is decelerated or moved at a constant velocity.