APPARATUS FOR PROCESSING SUBSTRATE
    1.
    发明公开

    公开(公告)号:US20240017284A1

    公开(公告)日:2024-01-18

    申请号:US18138038

    申请日:2023-04-22

    CPC classification number: B05C9/08

    Abstract: An apparatus for processing a substrate includes a processing vessel disposed in a process chamber and including a processing space in which a substrate is accommodated; a liquid supply line configured to process the substrate by supplying processing liquid to the substrate in the processing space; an exhaust line connected to the processing vessel and configured to exhaust gas in the processing space; a spraying portion disposed on the exhaust line and configured to spray cleaning liquid to remove contaminants accumulated in the exhaust line; and a washing liquid discharge line branched from the exhaust line and including a suction portion therein to suction cleaning liquid waste including contaminants removed from the exhaust line by the cleaning liquid and to discharge the cleaning liquid waste to the outside.

    SUBSTRATE TREATING APPARATUS AND CLEANING METHOD THEREOF

    公开(公告)号:US20240198393A1

    公开(公告)日:2024-06-20

    申请号:US18510663

    申请日:2023-11-16

    CPC classification number: B08B3/08 B08B3/02 B08B5/04 G03F7/70925

    Abstract: A substrate treating apparatus and a cleaning method thereof that can clean a nozzle tip and its surroundings in the presence of a source of contamination are provided. The substrate treating apparatus includes: a substrate support unit supporting a substrate; a spraying unit including a nozzle tip member, which has an outlet formed at an end thereof, and ejecting a treating solution onto the substrate using the nozzle tip member; and a standby port accommodating the nozzle tip member that has completed the ejection of the treating solution, wherein the substrate treating apparatus cleans the nozzle tip member and the inside of the standby port before the nozzle tip member sucks back a second chemical solution.

    METHOD FOR LIFTING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATE

    公开(公告)号:US20210202296A1

    公开(公告)日:2021-07-01

    申请号:US17138427

    申请日:2020-12-30

    Abstract: A method for lifting a substrate includes raising the substrate off a support plate having the substrate placed thereon, by using a lift pin, in which the lift pin raises the substrate off the support plate while vertically moving between a lowered position spaced apart downward from the support plate by a first distance and a raised position spaced apart upward from the support plate by a second distance, and the lift pin is brought into contact with the substrate in an interval in which the lift pin is decelerated or moved at a constant velocity.

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