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公开(公告)号:US20240017284A1
公开(公告)日:2024-01-18
申请号:US18138038
申请日:2023-04-22
Applicant: SEMES CO., LTD.
Inventor: Dae Sung KIM , Jae Hyun LIM , Kyo Sang YOON , Ho Jin JANG , A Rah CHO
IPC: B05C9/08
CPC classification number: B05C9/08
Abstract: An apparatus for processing a substrate includes a processing vessel disposed in a process chamber and including a processing space in which a substrate is accommodated; a liquid supply line configured to process the substrate by supplying processing liquid to the substrate in the processing space; an exhaust line connected to the processing vessel and configured to exhaust gas in the processing space; a spraying portion disposed on the exhaust line and configured to spray cleaning liquid to remove contaminants accumulated in the exhaust line; and a washing liquid discharge line branched from the exhaust line and including a suction portion therein to suction cleaning liquid waste including contaminants removed from the exhaust line by the cleaning liquid and to discharge the cleaning liquid waste to the outside.
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公开(公告)号:US20240198393A1
公开(公告)日:2024-06-20
申请号:US18510663
申请日:2023-11-16
Applicant: SEMES CO., LTD.
Inventor: Yong Chul KWAK , Jung Hyun LEE , Jae Ho YOO , Kyo Sang YOON , Hye Bin BAEK
CPC classification number: B08B3/08 , B08B3/02 , B08B5/04 , G03F7/70925
Abstract: A substrate treating apparatus and a cleaning method thereof that can clean a nozzle tip and its surroundings in the presence of a source of contamination are provided. The substrate treating apparatus includes: a substrate support unit supporting a substrate; a spraying unit including a nozzle tip member, which has an outlet formed at an end thereof, and ejecting a treating solution onto the substrate using the nozzle tip member; and a standby port accommodating the nozzle tip member that has completed the ejection of the treating solution, wherein the substrate treating apparatus cleans the nozzle tip member and the inside of the standby port before the nozzle tip member sucks back a second chemical solution.
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公开(公告)号:US20210202296A1
公开(公告)日:2021-07-01
申请号:US17138427
申请日:2020-12-30
Applicant: SEMES CO., LTD.
Inventor: Sukhwan CHI , Kyo Sang YOON , Bo Hee LEE , Byoungdoo CHOI
IPC: H01L21/687 , H01L21/67 , H01L21/677
Abstract: A method for lifting a substrate includes raising the substrate off a support plate having the substrate placed thereon, by using a lift pin, in which the lift pin raises the substrate off the support plate while vertically moving between a lowered position spaced apart downward from the support plate by a first distance and a raised position spaced apart upward from the support plate by a second distance, and the lift pin is brought into contact with the substrate in an interval in which the lift pin is decelerated or moved at a constant velocity.
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