公开(公告)号：US20230377932A1

公开(公告)日：2023-11-23

申请号：US18311999

申请日：2023-05-04

Applicant: SEMES CO., LTD.

Inventor： Dongchan LEE ,  Su Hyung LEE

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01J37/32724

Abstract: A substrate support device according to one aspect of the present invention includes a seating plate part on which a substrate is seated, a shaft part coupled to a lower portion of the seating plate part to support the seating plate part, and a gap flange part coupled to the shaft part or the seating plate part to define a thermal insulation gap between the shaft part and the gap flange part and between the seating plate part and the gap flange part, the gap flange part including a gas inlet port and a gas outlet port so that cooling gas circulates in the thermal insulation gap.

公开(公告)号：US20230215708A1

公开(公告)日：2023-07-06

申请号：US18148044

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Dongchan LEE ,  Jaekyung LEE ,  Jiseok KIM ,  Jehee LEE ,  Kiryong LEE

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32642 ,  H01J2237/2007 ,  H01J2237/002 ,  H01J2237/334 ,  H01L21/6833

Abstract: Provided is a substrate support unit including an electrostatic chuck configured to fix a wafer, an insulating isolation unit, which is arranged below the electrostatic chuck and is configured to insulate the electrostatic chuck, and a ground plate arranged below the insulating isolation unit, wherein the electrostatic chuck, the insulating isolation unit, and the ground plate are spaced apart from each other in a vertical direction, and a lower surface of the electrostatic chuck, a surface of the insulating isolation unit, or a surface of the ground plate has hydrophobicity.