APPARATUS AND METHOD FOR TREATING SUBSTRATE

    公开(公告)号:US20210020478A1

    公开(公告)日:2021-01-21

    申请号:US16931733

    申请日:2020-07-17

    Abstract: An apparatus for treating a substrate includes a housing having a treatment space therein, a heating plate that supports the substrate in the treatment space and that has a plurality of heating members inside, and a temperature control unit that controls the plurality of heating members to heat the substrate supported on the heating plate, in which the temperature control unit controls the plurality of heating members using a plurality of control signals with different control periods.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    2.
    发明申请

    公开(公告)号:US20200211874A1

    公开(公告)日:2020-07-02

    申请号:US16726293

    申请日:2019-12-24

    Abstract: Disclosed is a substrate treating apparatus that includes a housing having a process space therein, a plate that supports a substrate in the housing, a heating member that is provided in the plate and that heats the substrate, a plurality of controllers that control the heating member and that have different gains, a temperature measurement member that measures temperature in the housing, and a control member that switches the plurality of controllers to cause one of the plurality of controllers to control the heating member depending on a temperature drop section, a temperature rise section, and an anneal section in the housing.

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    3.
    发明申请

    公开(公告)号:US20200381279A1

    公开(公告)日:2020-12-03

    申请号:US16886321

    申请日:2020-05-28

    Abstract: An apparatus for treating a substrate includes a housing having a treatment space therein, a plate that supports the substrate in the housing, a heating unit having a heating wire that is provided inside the plate and that heats the substrate, a main temperature sensor that directly measures temperatures of the plate, and an auxiliary temperature sensor that measures temperatures of the heating wire.

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