公开(公告)号：US20200211874A1

公开(公告)日：2020-07-02

申请号：US16726293

申请日：2019-12-24

Applicant: SEMES CO., LTD.

Inventor： Sung Yong LEE ,  Donghyuk SEO ,  Sangbok HAN ,  Tae Sub LEE

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/66 ,  G03F7/20

Abstract: Disclosed is a substrate treating apparatus that includes a housing having a process space therein, a plate that supports a substrate in the housing, a heating member that is provided in the plate and that heats the substrate, a plurality of controllers that control the heating member and that have different gains, a temperature measurement member that measures temperature in the housing, and a control member that switches the plurality of controllers to cause one of the plurality of controllers to control the heating member depending on a temperature drop section, a temperature rise section, and an anneal section in the housing.

公开(公告)号：US20230072272A1

公开(公告)日：2023-03-09

申请号：US17902056

申请日：2022-09-02

Applicant: SEMES CO., LTD.

Inventor： Tae Sub LEE ,  Gyu Hyun KIM ,  Sung Yong LEE ,  Dong Hyuk SEO

IPC: H01L21/67

Abstract: Provided is a heating unit including: a heating plate for heating a substrate; a heater installed in the heating plate; and a control unit for controlling the heater, in which wherein the heater includes: a first heater; and a second heater installed at a position different from a position of the first heater, and the control unit includes: a power source for transferring power to at least one of the first heater and the second heater; and a switching module for connecting the first heater and the second heater in series or connecting the first heater and the second heater in parallel.