Substrate treating apparatus and method

    公开(公告)号:US10357806B2

    公开(公告)日:2019-07-23

    申请号:US14747287

    申请日:2015-06-23

    Abstract: The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing proving an inner space in which a substrate is treated, a spin head supporting and rotating the substrate in the housing, an injection unit comprising a first nozzle member spraying a first treatment solution to the substrate put on the spin head, and a controller controlling the first nozzle member. The first nozzle member includes a body, a vibrator, a pump, and a power source.

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