公开(公告)号：US12074040B2

公开(公告)日：2024-08-27

申请号：US17829678

申请日：2022-06-01

Applicant: SEMES CO., LTD.

Inventor： Ji Ho Kim ,  Jong Han Kim ,  Ju Dong Lee ,  Ju Hwan Lee ,  Hyeon Jun Lee

IPC: B05B11/02 ,  B05C5/02 ,  B05C11/10 ,  F16K1/32 ,  F16K1/36 ,  F16K31/122 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67051 ,  B05B11/02 ,  B05C5/02 ,  B05C11/10 ,  F16K1/32 ,  F16K1/36 ,  F16K31/1221 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67017 ,  H01L21/6708

Abstract: The inventive concept provides a liquid treating apparatus. The liquid treating apparatus includes a spin chuck configured to support and rotate a substrate; and a liquid supply unit configured to supply a liquid to the substrate, and wherein the liquid supply unit includes: a first nozzle connected to a first flow path pipe and configured to discharge a first liquid to the substrate; a first valve assembly including a first cut-off valve for cutting-off a flow of the first liquid within the first flow path pipe and a first suck-back valve for sucking-back the first liquid, and installed at the first flow pipe; a second nozzle connected to a second flow path pipe and configured to discharge a second liquid to the substrate; a second valve assembly including a second cut-off valve for cutting-off a flow of the second liquid within the second flow path pipe and a second suck-back valve for sucking-back the second liquid, and installed at the second flow pipe path; a first flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the first suck-back valve; and a second flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the second suck-back valve, and wherein a first speed of a suck-back speed provided by the first valve assembly is slower than a second suck-back speed provided by the second valve assembly, and a surface tension of the first liquid is lower than a surface tension of the second liquid.

公开(公告)号：US12278118B2

公开(公告)日：2025-04-15

申请号：US17520588

申请日：2021-11-05

Applicant: SEMES CO., LTD.

Inventor： Seung Tae Yang ,  Jong Han Kim ,  Do Gyeong Ha

IPC: H01L21/67 ,  H01L21/02

Abstract: A substrate processing apparatus a processing liquid supply unit includes a nozzle supplying a processing liquid onto the substrate, a supply line connected to the nozzle to supply the processing liquid to the nozzle, and a cooler cooling the processing liquid. A volume of the processing liquid is reduced by the cooler so that the processing liquid may be sucked.

公开(公告)号：US10357806B2

公开(公告)日：2019-07-23

申请号：US14747287

申请日：2015-06-23

Applicant: SEMES CO., LTD.

Inventor： Jong Han Kim ,  Yoon-Jong Ju ,  Yu Hwan Kim ,  Edwin Lee ,  Seong Soo Lee

IPC: B08B3/02 ,  H01L21/67 ,  B05B17/00 ,  B05B13/02

Abstract: The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing proving an inner space in which a substrate is treated, a spin head supporting and rotating the substrate in the housing, an injection unit comprising a first nozzle member spraying a first treatment solution to the substrate put on the spin head, and a controller controlling the first nozzle member. The first nozzle member includes a body, a vibrator, a pump, and a power source.