公开(公告)号：US20240093940A1

公开(公告)日：2024-03-21

申请号：US18120981

申请日：2023-03-13

Applicant: SEMES CO., LTD.

Inventor： HAE-WON CHOI ,  JAE SEONG LEE ,  HONG CHAN CHO

IPC: F26B25/06 ,  F26B5/00

CPC classification number: F26B25/066 ,  F26B5/005

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first chamber having a supply port for supplying a treating fluid; a second chamber in combination with the first chamber defining a treating space; a support member configured to support a substrate in the treating space; and a baffle unit installed in the first chamber to face the support port, and wherein the baffle unit includes: a first baffle assembly including a first baffle having first holes through which the treating fluid flow; and a second baffle assembly installed at a position farther from the support port than the first baffle assembly, and including a second baffle having second holes through which the treating fluid flow.