公开(公告)号：US20230162994A1

公开(公告)日：2023-05-25

申请号：US17990715

申请日：2022-11-20

Applicant: SEMES CO., LTD.

Inventor： JAE SEONG LEE

IPC: H01L21/67 ,  C23C16/44 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/6704 ,  C23C16/4412 ,  H01L21/6875 ,  H01L21/02101

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber body having a top body and a bottom body which combine to provide a treating space therein; a substrate support unit configured to support a substrate at the treating space; a fluid supply unit configured to supply a treating fluid to the treating space; a fluid exhaust line for exhausting the treating fluid from the treating space; and a guide member provided to surround a periphery of the substrate supported by the substrate support unit.

公开(公告)号：US20240093940A1

公开(公告)日：2024-03-21

申请号：US18120981

申请日：2023-03-13

Applicant: SEMES CO., LTD.

Inventor： HAE-WON CHOI ,  JAE SEONG LEE ,  HONG CHAN CHO

IPC: F26B25/06 ,  F26B5/00

CPC classification number: F26B25/066 ,  F26B5/005

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a first chamber having a supply port for supplying a treating fluid; a second chamber in combination with the first chamber defining a treating space; a support member configured to support a substrate in the treating space; and a baffle unit installed in the first chamber to face the support port, and wherein the baffle unit includes: a first baffle assembly including a first baffle having first holes through which the treating fluid flow; and a second baffle assembly installed at a position farther from the support port than the first baffle assembly, and including a second baffle having second holes through which the treating fluid flow.