公开(公告)号：US10969700B2

公开(公告)日：2021-04-06

申请号：US16504092

申请日：2019-07-05

Applicant: SEMES CO., LTD.

Inventor： Hwangsoo Park ,  Jun Ho You

IPC: C23C16/02 ,  G03F7/20

Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig supported on the rotating support plate. In the vessel cleaning step, the jig is located such that the center of the jig is offset from the center of the support plate.

公开(公告)号：US10991601B2

公开(公告)日：2021-04-27

申请号：US16515299

申请日：2019-07-18

Applicant: SEMES CO., LTD.

Inventor： Hwangsoo Park ,  Jun Ho You ,  Doo Young Oh ,  Jaehun Jeong

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/683 ,  H01L21/687 ,  G03F7/20

Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.