公开(公告)号：US10969700B2

公开(公告)日：2021-04-06

申请号：US16504092

申请日：2019-07-05

Applicant: SEMES CO., LTD.

Inventor： Hwangsoo Park ,  Jun Ho You

IPC: C23C16/02 ,  G03F7/20

Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig supported on the rotating support plate. In the vessel cleaning step, the jig is located such that the center of the jig is offset from the center of the support plate.

公开(公告)号：US11626309B2

公开(公告)日：2023-04-11

申请号：US17513734

申请日：2021-10-28

Applicant: SEMES CO., LTD.

Inventor： Jun Ho You

IPC: H01L21/68 ,  G03F7/20 ,  H01L21/687

Abstract: A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.

公开(公告)号：US09966285B2

公开(公告)日：2018-05-08

申请号：US15161410

申请日：2016-05-23

Applicant: SEMES CO., LTD.

Inventor： Duk Sik Kim ,  Jun Ho You

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01L21/67259 ,  H01L21/6708 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/681 ,  H01L21/68707

Abstract: Disclosed is a teaching method of setting a location of a robot that transports a substrate onto a rotatable support plate that supports the substrate, the teaching method including setting the location of the robot by using decentering values that are acquired by performing an operation of loading the substrate on the support plate with the robot, rotating the support plate by a preset angle, unloading the substrate from the support plate with the robot, and detecting a decentering value of the substrate positioned on a hand of the robot a plurality of times.

公开(公告)号：US10991601B2

公开(公告)日：2021-04-27

申请号：US16515299

申请日：2019-07-18

Applicant: SEMES CO., LTD.

Inventor： Hwangsoo Park ,  Jun Ho You ,  Doo Young Oh ,  Jaehun Jeong

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/683 ,  H01L21/687 ,  G03F7/20

Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.