公开(公告)号：US11927886B2

公开(公告)日：2024-03-12

申请号：US17194174

申请日：2021-03-05

Applicant: SEMES CO., LTD.

Inventor： Doo Young Oh ,  Joon Jae Lee

IPC: H01L21/02 ,  B05C9/12 ,  B05C11/10 ,  G03F7/00 ,  G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  H01L21/67 ,  H01L21/677

CPC classification number: G03F7/2041 ,  B05C9/12 ,  B05C11/1044 ,  G03F7/0035 ,  G03F7/0048 ,  G03F7/162 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67745

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. According to an embodiment of the inventive concept, the purge operation of the purge nozzle is performed while the nozzle arm is moved from the first substrate support member to the second substrate support member, it hardly influences the operation of treating the substrate while the nozzle arm is moved from the first substrate support member to the second substrate support member. According to an embodiment of the inventive concept, the substrate treating apparatus may perform an operation of purging the photosensitive liquid nozzle while the treatment liquid supply unit performs a process of supplying the photosensitive liquid to the substrate. Accordingly, because the operation of purging the photosensitive liquid nozzle is performed at the same time when the substrate treating apparatus performs a process, productivity may be improved.

公开(公告)号：US10991601B2

公开(公告)日：2021-04-27

申请号：US16515299

申请日：2019-07-18

Applicant: SEMES CO., LTD.

Inventor： Hwangsoo Park ,  Jun Ho You ,  Doo Young Oh ,  Jaehun Jeong

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/683 ,  H01L21/687 ,  G03F7/20

Abstract: A method for treating a substrate includes a substrate treating step of treating the substrate by dispensing a treating liquid onto the substrate while rotating the substrate supported on a support plate in a processing space of a processing vessel and a vessel cleaning step of cleaning the processing vessel by dispensing a cleaning solution onto a jig while rotating the jig supported on the support plate. In the substrate treating step, the substrate is clamped to the support plate by a first vacuum pressure applied to the substrate. The vessel cleaning step includes a first clamping step of clamping the jig to the support plate by applying a second vacuum pressure to the jig. The first vacuum pressure and the second vacuum pressure are different from each other.

公开(公告)号：US10969688B2

公开(公告)日：2021-04-06

申请号：US16033480

申请日：2018-07-12

Applicant: SEMES CO., LTD.

Inventor： Doo Young Oh ,  Joon Jae Lee

IPC: G03F7/20 ,  G03F7/00 ,  G03F7/004 ,  H01L21/67 ,  H01L21/677 ,  G03F7/16 ,  B05C11/10 ,  B05C9/12

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. According to an embodiment of the inventive concept, the purge operation of the purge nozzle is performed while the nozzle arm is moved from the first substrate support member to the second substrate support member, it hardly influences the operation of treating the substrate while the nozzle arm is moved from the first substrate support member to the second substrate support member. According to an embodiment of the inventive concept, the substrate treating apparatus may perform an operation of purging the photosensitive liquid nozzle while the treatment liquid supply unit performs a process of supplying the photosensitive liquid to the substrate. Accordingly, because the operation of purging the photosensitive liquid nozzle is performed at the same time when the substrate treating apparatus performs a process, productivity may be improved.

公开(公告)号：US11244848B2

公开(公告)日：2022-02-08

申请号：US16430692

申请日：2019-06-04

Applicant: SEMES CO., LTD.

Inventor： Hoshin Kang ,  Dong Yeon Kang ,  Doo Young Oh

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

Abstract: A method for treating a substrate using a substrate treating apparatus that includes a treating module and an index module that transfers the substrate between a container and the treating module, in which a plurality of process chambers and a main transfer robot are provided in the treating module and a container mounting table and an index robot that transfers the substrate between the container and the treating module are provided in the index module, includes executing a power failure after-treatment operation and thereafter stopping an operation of the substrate treating apparatus when a power failure occurs in the substrate treating apparatus. When the main transfer robot or the index robot is transferring the substrate in the event of the power failure, the power failure after-treatment operation includes an operation of continually maintaining the transfer of the main transfer robot or the index robot until the transfer is completed.