公开(公告)号：US20210112662A1

公开(公告)日：2021-04-15

申请号：US17069977

申请日：2020-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Sanghyun SON ,  Sangmin HA ,  Hyeongjun CHO ,  Dongok AHN

IPC: H05K1/18 ,  H01L21/67

Abstract: Disclosed is a wafer-type sensor unit. The wafer-type sensor unit according to an embodiment of the inventive concept may include a circuit board and an electronic element including a sensor installed on the circuit board. The electronic element may be disposed on the circuit board such that a center of gravity of the wafer-type sensor unit is provided to a center part of the sensor unit. The electronic element may further include a power supply unit and a signal processing unit processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board.

公开(公告)号：US20240243801A1

公开(公告)日：2024-07-18

申请号：US18408681

申请日：2024-01-10

Applicant: SEMES CO., LTD.

Inventor： Jongsuk WON ,  Hyeongjun CHO

IPC: H04B7/155

CPC classification number: H04B7/15507 ,  H04B7/15535

Abstract: The present invention provides a multi-faceted signal amplification repeater including N (N is an integer of 3 or more) repeater modules surrounding a cable for signal transmission between a transmitting end and a receiving end; and N connect pins connecting the N repeater modules to each other, wherein among the N repeater modules, M (M is an integer greater than or equal to 1 but less than N) repeater modules are repeater units that amplify a signal transmitted through the cable, and among the N repeater modules, L (L is an integer equal to N−M) power units are power units that supply power for an operation of the repeater units.