公开(公告)号：US20240151767A1

公开(公告)日：2024-05-09

申请号：US18387580

申请日：2023-11-07

Applicant: SEMES CO., LTD.

Inventor： Yongjun SEO ,  Sujin CHAE ,  Sanghyun SON ,  Sangmin HA ,  Youngsik BANG ,  Jeongmo HWANG ,  Dongok AHN

IPC: G01R31/28

CPC classification number: G01R31/2831

Abstract: Provided are a wafer-type measuring apparatus capable of accurately measuring the magnetic flux density in a process chamber without opening the process chamber, and a magnetic flux density measuring method using the wafer-type measuring apparatus. The wafer-type measuring apparatus includes a wafer-type substrate, magnetic flux density sensors disposed on the wafer-type substrate and configured to measure a magnetic flux density, a power supply disposed on the substrate and configured to supply power to the magnetic flux density sensors, a microcontroller unit (MCU) disposed on the substrate and configured to signal process the measured magnetic flux density, and a wireless communication module disposed on the substrate and configured to transmit a signal from the MCU to the outside, and measure the magnetic flux density in a process chamber using a magnetic field.

公开(公告)号：US20210112662A1

公开(公告)日：2021-04-15

申请号：US17069977

申请日：2020-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Sanghyun SON ,  Sangmin HA ,  Hyeongjun CHO ,  Dongok AHN

IPC: H05K1/18 ,  H01L21/67

Abstract: Disclosed is a wafer-type sensor unit. The wafer-type sensor unit according to an embodiment of the inventive concept may include a circuit board and an electronic element including a sensor installed on the circuit board. The electronic element may be disposed on the circuit board such that a center of gravity of the wafer-type sensor unit is provided to a center part of the sensor unit. The electronic element may further include a power supply unit and a signal processing unit processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board.