公开(公告)号：US20210122154A1

公开(公告)日：2021-04-29

申请号：US17079029

申请日：2020-10-23

Applicant: SEMES CO., LTD.

Inventor： Kwangsup KIM ,  Dongok AHN ,  Junho OH ,  Ji Hoon YOO ,  Myeong Jun LIM

IPC: B41J2/045

Abstract: An inspection module is disclosed for inspecting a droplet from an ink jet head. The inspection module includes a sensor located under the ink jet head and measuring a distance between the droplet and the sensor in real time; a variable lens changing an operating distance based on the measured distance of the sensor; and a camera for capturing an image of the droplet. The inspection module further includes a droplet inspecting part inspecting the droplet image captured by the camera.

公开(公告)号：US20210112662A1

公开(公告)日：2021-04-15

申请号：US17069977

申请日：2020-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Sanghyun SON ,  Sangmin HA ,  Hyeongjun CHO ,  Dongok AHN

IPC: H05K1/18 ,  H01L21/67

Abstract: Disclosed is a wafer-type sensor unit. The wafer-type sensor unit according to an embodiment of the inventive concept may include a circuit board and an electronic element including a sensor installed on the circuit board. The electronic element may be disposed on the circuit board such that a center of gravity of the wafer-type sensor unit is provided to a center part of the sensor unit. The electronic element may further include a power supply unit and a signal processing unit processing a signal on the circuit board. The wafer-type sensor unit may further include one or more dummy elements installed on the circuit board.

公开(公告)号：US20240206017A1

公开(公告)日：2024-06-20

申请号：US18539966

申请日：2023-12-14

Applicant: SEMES CO., LTD.

Inventor： Sanghyon JEON ,  Ikho LEE ,  Dongok AHN

IPC: H05B1/02

CPC classification number: H05B1/0288

Abstract: A temperature control apparatus includes a heater of which a temperature increases in response to receiving power, a power source supplying alternating current (AC) power to the heater, a temperature sensor sensing the temperature of the heater and outputting a measured temperature value, and a controller controlling the power supply to the heater so that the heater follows a set temperature profile, wherein the controller supplies the power to the heater for first one control period in a variable period consisting of a plurality number of times of control periods (on duty), and stops the power supply to the heater during remaining control periods until the variable period is finished (off duty).

公开(公告)号：US20240151767A1

公开(公告)日：2024-05-09

申请号：US18387580

申请日：2023-11-07

Applicant: SEMES CO., LTD.

Inventor： Yongjun SEO ,  Sujin CHAE ,  Sanghyun SON ,  Sangmin HA ,  Youngsik BANG ,  Jeongmo HWANG ,  Dongok AHN

IPC: G01R31/28

CPC classification number: G01R31/2831

Abstract: Provided are a wafer-type measuring apparatus capable of accurately measuring the magnetic flux density in a process chamber without opening the process chamber, and a magnetic flux density measuring method using the wafer-type measuring apparatus. The wafer-type measuring apparatus includes a wafer-type substrate, magnetic flux density sensors disposed on the wafer-type substrate and configured to measure a magnetic flux density, a power supply disposed on the substrate and configured to supply power to the magnetic flux density sensors, a microcontroller unit (MCU) disposed on the substrate and configured to signal process the measured magnetic flux density, and a wireless communication module disposed on the substrate and configured to transmit a signal from the MCU to the outside, and measure the magnetic flux density in a process chamber using a magnetic field.

公开(公告)号：US20230044888A1

公开(公告)日：2023-02-09

申请号：US17965911

申请日：2022-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Hyun YOON ,  Jungsuk GOH ,  Byeong Geun KIM ,  Yoonki SA ,  Doyeon KIM ,  Yerim YEON ,  Choonghyun LEE ,  Pil Kyun HEO ,  Youngje UM ,  Jaeseong LEE ,  Dongok AHN

IPC: H01L21/02 ,  H01L21/67

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US20210050210A1

公开(公告)日：2021-02-18

申请号：US16993442

申请日：2020-08-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Hyun YOON ,  Jungsuk GOH ,  Byeong Geun KIM ,  Yoonki SA ,  Doyeon KIM ,  Yerim YEON ,  Choonghyun LEE ,  Pil Kyun HEO ,  Youngje UM ,  Jaeseong LEE ,  Dongok AHN

IPC: H01L21/02 ,  H01L21/67

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.