公开(公告)号：US20150155188A1

公开(公告)日：2015-06-04

申请号：US14556380

申请日：2014-12-01

Applicant: SEMES CO., LTD.

Inventor： In-II Jung ,  Woo-Young Kim ,  Young il Lee ,  Boong Kim

IPC: H01L21/67 ,  B08B7/00 ,  F26B21/10 ,  H01J37/32

CPC classification number: F26B21/10 ,  H01J37/32816 ,  H01J37/32825 ,  H01J37/32834 ,  H01J37/32935 ,  H01J37/3299 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a predetermined process is performed on a substrate, a pressure meter measuring a pressure within the process chamber, and a controller receiving the measured pressure value from the pressure meter to determine an opening time of the process chamber. The controller opens the process chamber when a set condition elapses from a time at which the pressure within the process chamber reaches a preset opening pressure.

Abstract translation: 提供了一种基板处理装置。 基板处理装置包括处理室，其中在基板上执行预定处理，测量处理室内的压力的压力计以及从压力计接收测量的压力值的控制器以确定该过程的打开时间 房间。 当处理室中的压力达到预设打开压力的时间过去了设定状态时，控制器打开处理室。