MENISCUS MEASURING APPARATUS AND METHOD, SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20230063647A1

    公开(公告)日:2023-03-02

    申请号:US17885552

    申请日:2022-08-11

    Abstract: A meniscus measuring method capable of quickly and accurately measuring meniscus positions in a plurality of nozzles of an inkjet head can be provided. The meniscus measuring method comprises providing a head unit capable of discharging ink through a plurality of nozzles, adhering ink remaining in the plurality of nozzles to a film to form a detection pattern on the film by bringing the film into close contact with the plurality of nozzles, measuring meniscus of ink remaining in the plurality of nozzles based on the detection pattern.

    DROPLET ANALYSIS UNIT AND SUBSTRATE TREATMENT APPARATUS INCLUDING THE SAME

    公开(公告)号:US20240034056A1

    公开(公告)日:2024-02-01

    申请号:US18346984

    申请日:2023-07-05

    Abstract: A droplet analysis unit capable of measuring and digitizing the meniscus shape, motion, and position of ink droplets and a substrate treatment apparatus including the droplet analysis unit are provided. The substrate treatment apparatus includes: a process treatment unit supporting a substrate while the substrate is being treated; an inkjet head unit treating the substrate by ejecting a substrate treatment liquid onto the substrate using a plurality of nozzles; a gantry unit moving the inkjet head unit over the substrate; and a droplet analysis unit measuring a meniscus in each of the nozzles that is associated with the substrate treatment liquid, wherein the droplet analysis unit measures and quantifies three-dimensional (3D) information regarding the meniscus based on chromatic aberration.

    FRINGE INFORMATION MEASURING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME

    公开(公告)号:US20230134959A1

    公开(公告)日:2023-05-04

    申请号:US17958435

    申请日:2022-10-03

    Abstract: Provided are a fringe information measuring apparatus that measures information on a fringe region using a temperature sensor array and a substrate treating system including the same. The fringe information measuring apparatus comprises: a laser sensor configured to output a first laser light and a second laser light to intersect each other; a thermal sensor array configured to pass through a fringe region formed by the intersection of the first laser light and the second laser light; and a control module configured to measure a position of the fringe region based on information obtained when the thermal sensor array passes through the fringe region.

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