APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20250105026A1

    公开(公告)日:2025-03-27

    申请号:US18810501

    申请日:2024-08-20

    Abstract: An apparatus for processing a substrate includes a heating unit heating the substrate and including a hot plate having a vacuum hole; a fume collection unit including a housing, an inlet portion connected to the vacuum hole and introducing a mixed gas containing fumes generated in heating the substrate within an internal space of the housing, and an outlet portion discharging a gas from which the fumes have been removed to an external space of the housing; a vacuum unit connected to the fume collection unit and vacuum-adsorbing the substrate onto the hot plate when the substrate is heated; and a chilling unit including a cooling body, a coolant inflow fluid passage introducing a coolant into the cooling body, a coolant discharge fluid passage discharging the coolant from the cooling body, and a bypass fluid passage connecting the coolant inflow fluid passage and the coolant discharge fluid passage.

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